Invention Grant
US09318494B2 Methods of forming positioned landing pads and semiconductor devices including the same
有权
形成定位的着陆垫和包括其的半导体器件的方法
- Patent Title: Methods of forming positioned landing pads and semiconductor devices including the same
- Patent Title (中): 形成定位的着陆垫和包括其的半导体器件的方法
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Application No.: US14692789Application Date: 2015-04-22
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Publication No.: US09318494B2Publication Date: 2016-04-19
- Inventor: Kyung-Eun Kim , Dae-Ik Kim , Young-Seung Cho
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel & Sibley, P.A.
- Priority: KR10-2014-0090725 20140718
- Main IPC: H01L27/10
- IPC: H01L27/10 ; H01L27/108 ; H01L21/02 ; H01L21/768 ; H01L21/311

Abstract:
A method of forming a DRAM can include forming a plurality of transistors arranged in a first direction on a substrate and forming a bit line structure that extends in the first direction, where the bit line structure being electrically coupled to the plurality of transistors at respective locations in the first direction. A plurality of first landing pads an be formed at alternating ones of the respective locations having a first position in a second direction on the substrate. A plurality of second landing pads can be formed at intervening ones of the respective locations between the alternating ones of the respective locations, where the intervening ones of the respective locations having a second position in the second direction on the substrate wherein second position is shifted in the second direction relative to the first position.
Public/Granted literature
- US20160020213A1 METHODS OF FORMING POSITIONED LANDING PADS AND SEMICONDUCTOR DEVICES INCLUDING THE SAME Public/Granted day:2016-01-21
Information query
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