Invention Grant
- Patent Title: Semiconductor device and method of fabricating the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US14273789Application Date: 2014-05-09
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Publication No.: US09318607B2Publication Date: 2016-04-19
- Inventor: Jae-Woo Seo , Gun-Ok Jung , Min-Su Kim , Sang-Shin Han , Ju-Hyun Kang , Uk-Rae Cho
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2013-0126065 20131022
- Main IPC: H01L23/528
- IPC: H01L23/528 ; H01L27/02 ; H01L29/78 ; H01L23/538 ; H01L27/092 ; H01L27/12 ; H01L27/06 ; H01L23/00 ; H01L25/10

Abstract:
Provided are a semiconductor device and a method of fabricating the semiconductor device. The semiconductor device includes a first source electrode configured to connect a first power rail to a first impurity region, the first power rail coupled to a first voltage source, a second source electrode configured to connect a second power rail to a second impurity region, the second power rail coupled to a second voltage source, the first and second voltage sources being different, a gate electrode on the first and second impurity regions, a first drain electrode on the first impurity region, a second drain electrode on the second impurity region and an interconnection line connected to the first drain electrode and the second drain electrode, the interconnection line forming at least one closed loop.
Public/Granted literature
- US20150014775A1 SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME Public/Granted day:2015-01-15
Information query
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