Invention Grant
- Patent Title: Electronic circuit module component
- Patent Title (中): 电子电路模块组件
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Application No.: US13958887Application Date: 2013-08-05
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Publication No.: US09320146B2Publication Date: 2016-04-19
- Inventor: Miyuki Yanagida , Hisayuki Abe
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2012-176675 20120809
- Main IPC: H01G4/228
- IPC: H01G4/228 ; H05K1/18 ; H05K3/34 ; H01G4/30 ; H01G2/06 ; H01G4/232

Abstract:
One aspect of an electronic circuit module component is an electronic circuit module component formed by joining a board and an electronic component comprising an element body having a mounting surface and a plurality of side faces to each other with solder; the electronic component comprising a first terminal electrode formed on the mounting surface and one of the plurality of side faces, a second terminal electrode formed on the mounting surface and another side face in the plurality of side faces, and an oxide film covering at least a part of surfaces of side face parts of the first and second terminal electrodes formed on the side faces; wherein mounting parts of the first and second terminal electrodes formed on the mounting surface are joined to the board with the solder.
Public/Granted literature
- US20140041913A1 ELECTRONIC CIRCUIT MODULE COMPONENT Public/Granted day:2014-02-13
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