Invention Grant
- Patent Title: Method to release diaphragm in MEMS device
- Patent Title (中): 在MEMS器件中释放隔膜的方法
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Application No.: US14092929Application Date: 2013-11-28
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Publication No.: US09321635B2Publication Date: 2016-04-26
- Inventor: Tsung-Min Hsieh , Chien-Hsing Lee , Jhyy-Cheng Liou
- Applicant: Solid State System Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Solid State System Co., Ltd.
- Current Assignee: Solid State System Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Jianq Chyun IP Office
- Main IPC: H01L21/00
- IPC: H01L21/00 ; B81C1/00
Abstract:
A method for releasing a diaphragm of a micro-electro-mechanical systems (MEMS) device at a stage of semi-finished product. The method includes pre-wetting the MEMS device in a pre-wetting solution to at least pre-wet a sidewall surface of a cavity of the MEMS device. Then, a wetting process after the step of pre-wetting the MEMS device is performed to etch a dielectric material of a dielectric layer for holding the diaphragm, wherein a sensing portion of the diaphragm is released from the dielectric layer.
Public/Granted literature
- US20150147841A1 METHOD TO RELEASE DIAPHRAGM IN MEMS DEVICE Public/Granted day:2015-05-28
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