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公开(公告)号：US20200068317A1
公开(公告)日：2020-02-27
申请号：US16112777
申请日：2018-08-27
Applicant: Solid State System Co., Ltd.
Inventor： Tsung-Min Hsieh , Li-Chi Tsao , Chien-Hsing Lee , Jhyy-Cheng Liou
Abstract: A structure of micro-electro-mechanical-system (MEMS) microphone package includes a packaging substrate and an integrated circuit disposed on the packaging substrate. In addition, a MEMS microphone is disposed on the packaging substrate, wherein the MEMS microphone is electrically connected to the integrated circuit. A conductive adhesion layer is disposed on the packaging substrate, surrounding the integrated circuit and the MEMS microphone. A cap structure has a bottom part being adhered to the conductive adhesion layer. An underfill layer is disposed on the packaging substrate, covering an outer side of the conductive adhesion layer.
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2.发明授权公开(公告)号：US09126827B2
公开(公告)日：2015-09-08
申请号：US14603371
申请日：2015-01-23
Applicant: Solid State System Co., Ltd.
Inventor： Tsung-Min Hsieh , Chien-Hsing Lee , Jhyy-Cheng Liou
CPC classification number: B81C1/00158 , B81B3/00 , B81B3/0013 , B81B7/00 , B81B2201/0257 , B81C1/00 , B81C1/00952 , H04R19/005 , H04R2201/003
Abstract: A method for fabricating MEMS device includes providing a silicon substrate. A structural dielectric layer is formed over a first side of the silicon substrate. Structure elements are embedded in the structural dielectric layer. The structure elements include a conductive backplate disposed over the silicon substrate, having venting holes and protrusion structures on top of the conductive backplate; and diaphragm located above the conductive backplate by a distance. A chamber is formed between the diaphragm and the conductive backplate. A cavity is formed in the silicon substrate at a second side. The cavity corresponds to the structure elements. An isotropic etching is performed on a dielectric material of the structural dielectric layer to release the structure elements. A first side of the diaphragm is exposed by the chamber and faces to the protrusion structures of the conductive backplate. A second side of the diaphragm is exposed to an environment space.
Abstract translation: 制造MEMS器件的方法包括提供硅衬底。 在硅衬底的第一侧上形成结构介电层。 结构元件嵌入在结构介电层中。 结构元件包括设置在硅衬底上的导电背板，在导电背板的顶部上具有通气孔和突出结构; 和隔膜位于导电背板上方一段距离。 在隔膜和导电背板之间形成一个室。 在第二侧的硅衬底中形成腔体。 空腔对应于结构元件。 对结构介电层的电介质材料进行各向同性蚀刻以释放结构元件。 隔膜的第一侧被室暴露，并面向导电背板的突出结构。 隔膜的第二面暴露于环境空间。
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3.发明授权公开(公告)号：US08673732B2
公开(公告)日：2014-03-18
申请号：US13906340
申请日：2013-05-31
Applicant: Solid State System Co., Ltd.
Inventor： Tsung-Min Hsieh , Chien-Hsing Lee , Jhyy-Cheng Liou
IPC: H01L21/76
CPC classification number: B81C1/00698 , B81C1/00682 , H01G5/18 , H04R19/005 , H04R19/04
Abstract: Method is to fabricate a MEMS device with a substrate. The substrate has through holes in the substrate within a diaphragm region and optionally an indent space from the second surface at the diaphragm region. A first dielectric structural layer is then disposed over the substrate from the first surface, wherein the first dielectric structural layer has a plurality of openings corresponding to the through holes, wherein each of the through holes remains exposed by the first dielectric structural layer. A second dielectric structural layer with a chamber is disposed over the first dielectric structural layer, wherein the chamber exposes the openings of the first dielectric structural layer and the through holes of the substrate to connect to the indent space. A MEMS diaphragm is embedded in the second dielectric structural layer above the chamber, wherein an air gap is formed between the substrate and the MEMS diaphragm.
Abstract translation: 方法是制造具有衬底的MEMS器件。 衬底在膜片区域内的衬底中具有通孔，并且可选地在隔膜区域处具有与第二表面相邻的凹陷空间。 然后，第一介电结构层从第一表面设置在衬底上，其中第一介电结构层具有对应于通孔的多个开口，其中每个通孔保持被第一介电结构层暴露。 具有腔室的第二电介质结构层设置在第一介电结构层上，其中腔室暴露第一介电结构层的开口和衬底的通孔以连接到凹陷空间。 MEMS隔膜嵌入在腔室上方的第二电介质结构层中，其中在衬底和MEMS隔膜之间形成气隙。
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公开(公告)号：US09955268B2
公开(公告)日：2018-04-24
申请号：US14328727
申请日：2014-07-11
Applicant: Solid State System Co., Ltd.
Inventor： Tsung-Min Hsieh , Chien-Hsing Lee , Cheng-Wei Tsai , Jhyy-Cheng Liou
CPC classification number: H04R19/005 , B81B7/0006 , B81B7/0058 , B81B2201/0257 , H04R23/006 , H04R2201/003 , H04R2460/11
Abstract: A micro-electrical-mechanical system (MEMS) microphone includes a MEMS structure, having a substrate, a diaphragm, and a backplate, wherein the substrate has a cavity and the backplate is between the cavity and the diaphragm. The backplate has multiple venting holes, which are connected to the cavity and allows the cavity to extend to the diaphragm. Further, an adhesive layer is disposed on the substrate, surrounding the cavity. A cover plate is adhered on the adhesive layer, wherein the cover plate has an acoustic hole, dislocated from the cavity without direct connection.
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公开(公告)号：US20150147841A1
公开(公告)日：2015-05-28
申请号：US14092929
申请日：2013-11-28
Applicant: Solid State System Co., Ltd.
Inventor： Tsung-Min Hsieh , Chien-Hsing Lee , Jhyy-Cheng Liou
IPC: B81C1/00
CPC classification number: B81C1/00928 , B81C1/00476
Abstract: A method for releasing a diaphragm of a micro-electro-mechanical systems (MEMS) device at a stage of semi-finished product. The method includes pre-wetting the MEMS device in a pre-wetting solution to at least pre-wet a sidewall surface of a cavity of the MEMS device. Then, a wetting process after the step of pre-wetting the MEMS device is performed to etch a dielectric material of a dielectric layer for holding the diaphragm, wherein a sensing portion of the diaphragm is released from the dielectric layer.
Abstract translation: 一种在半成品阶段释放微电子机械系统（MEMS）装置的隔膜的方法。 该方法包括将预先润湿溶液中的MEMS器件预润湿至少预先润湿MEMS器件的空腔的侧壁表面。 然后，执行在预先润湿MEMS器件的步骤之后的润湿过程，以蚀刻用于保持隔膜的电介质层的电介质材料，其中隔膜的感测部分从电介质层释放。
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Patent Agency Ranking
6.发明申请MICROELECTROMECHANICAL SYSTEM (MEMS) DEVICE AND FABRICATION METHOD THEREOF 审中-公开微电子机电系统（MEMS）器件及其制造方法公开(公告)号：US20150132880A1
公开(公告)日：2015-05-14
申请号：US14603371
申请日：2015-01-23
Applicant: Solid State System Co., Ltd.
Inventor： Tsung-Min Hsieh , Chien-Hsing Lee , Jhyy-Cheng Liou
IPC: B81C1/00
CPC classification number: B81C1/00158 , B81B3/00 , B81B3/0013 , B81B7/00 , B81B2201/0257 , B81C1/00 , B81C1/00952 , H04R19/005 , H04R2201/003
Abstract: A method for fabricating MEMS device includes providing a silicon substrate. A structural dielectric layer is formed over a first side of the silicon substrate. Structure elements are embedded in the structural dielectric layer. The structure elements include a conductive backplate disposed over the silicon substrate, having venting holes and protrusion structures on top of the conductive backplate; and diaphragm located above the conductive backplate by a distance. A chamber is formed between the diaphragm and the conductive backplate. A cavity is formed in the silicon substrate at a second side. The cavity corresponds to the structure elements. An isotropic etching is performed on a dielectric material of the structural dielectric layer to release the structure elements. A first side of the diaphragm is exposed by the chamber and faces to the protrusion structures of the conductive backplate. A second side of the diaphragm is exposed to an environment space.
Abstract translation: 制造MEMS器件的方法包括提供硅衬底。 在硅衬底的第一侧上形成结构介电层。 结构元件嵌入在结构介电层中。 结构元件包括设置在硅衬底上的导电背板，在导电背板的顶部上具有通气孔和突出结构; 和隔膜位于导电背板上方一段距离。 在隔膜和导电背板之间形成一个室。 在第二侧的硅衬底中形成腔体。 空腔对应于结构元件。 对结构介电层的电介质材料进行各向同性蚀刻以释放结构元件。 隔膜的第一侧被室暴露，并面向导电背板的突出结构。 隔膜的第二面暴露于环境空间。
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公开(公告)号：US10728674B2
公开(公告)日：2020-07-28
申请号：US16112777
申请日：2018-08-27
Applicant: Solid State System Co., Ltd.
Inventor： Tsung-Min Hsieh , Li-Chi Tsao , Chien-Hsing Lee , Jhyy-Cheng Liou
Abstract: A structure of micro-electro-mechanical-system (MEMS) microphone package includes a packaging substrate and an integrated circuit disposed on the packaging substrate. In addition, a MEMS microphone is disposed on the packaging substrate, wherein the MEMS microphone is electrically connected to the integrated circuit. A conductive adhesion layer is disposed on the packaging substrate, surrounding the integrated circuit and the MEMS microphone. A cap structure has a bottom part being adhered to the conductive adhesion layer. An underfill layer is disposed on the packaging substrate, covering an outer side of the conductive adhesion layer.
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公开(公告)号：US09321635B2
公开(公告)日：2016-04-26
申请号：US14092929
申请日：2013-11-28
Applicant: Solid State System Co., Ltd.
Inventor： Tsung-Min Hsieh , Chien-Hsing Lee , Jhyy-Cheng Liou
CPC classification number: B81C1/00928 , B81C1/00476
Abstract: A method for releasing a diaphragm of a micro-electro-mechanical systems (MEMS) device at a stage of semi-finished product. The method includes pre-wetting the MEMS device in a pre-wetting solution to at least pre-wet a sidewall surface of a cavity of the MEMS device. Then, a wetting process after the step of pre-wetting the MEMS device is performed to etch a dielectric material of a dielectric layer for holding the diaphragm, wherein a sensing portion of the diaphragm is released from the dielectric layer.
Abstract translation: 一种在半成品阶段释放微电子机械系统（MEMS）装置的隔膜的方法。 该方法包括将预先润湿溶液中的MEMS器件预润湿至少预先润湿MEMS器件的空腔的侧壁表面。 然后，执行在预先润湿MEMS器件的步骤之后的润湿过程，以蚀刻用于保持隔膜的电介质层的电介质材料，其中隔膜的感测部分从电介质层释放。
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9.发明授权Microelectro-mechanical systems (MEMS) microphone package device and MEMS packaging method thereof 有权微电子机械系统（MEMS）麦克风封装器件及其MEMS封装方法公开(公告)号：US09271087B1
公开(公告)日：2016-02-23
申请号：US14505495
申请日：2014-10-02
Applicant: Solid State System Co., Ltd.
Inventor： Tsung-Min Hsieh , Chien-Hsing Lee , Chih-Hsien Chung , Yong-Wei Chen , Jhyy-Cheng Liou
CPC classification number: H04R23/006 , H04R19/005 , H04R19/04 , H04R31/00 , H04R2201/003
Abstract: A MEMS microphone package device includes a MEMS microphone chip as an integrated circuit chip. An acoustic sensing structure is embedded in the integrated circuit chip. An adhesive structure adheres on outer sidewall of the microphone chip. A bottom portion of the adhesive structure protrudes out from first surface of the microphone chip and adheres on a surface of a substrate, having interconnection structure, to form a first seal ring. A space between the acoustic sensing structure and the substrate and sealed by the first seal ring forms a second chamber. A cover adheres to top portion of the adhesive structure, covering over the cavity on the second surface of the microphone chip. The top portion of the adhesive structure forms as a second seal ring. A space between the cover and the second surface of the microphone chip and sealed by the second seal ring forms a first chamber.
Abstract translation: MEMS麦克风封装器件包括作为集成电路芯片的MEMS麦克风芯片。 声学感测结构嵌入在集成电路芯片中。 粘合剂结构粘附在麦克风芯片的外侧壁上。 粘合剂结构的底部从麦克风芯片的第一表面突出出来并粘附在具有互连结构的基板的表面上，以形成第一密封环。 在声学检测结构和衬底之间并由第一密封环密封的空间形成第二腔室。 盖子粘附到粘合剂结构的顶部，覆盖在麦克风芯片的第二表面上的空腔上。 粘合剂结构的顶部形成为第二密封环。 所述盖和麦克风芯片的第二表面之间的空间被第二密封环密封形成第一腔室。
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10.发明授权Microelectromechanical system (MEMS) microphone with protection film and MEMS microphonechips at wafer level 有权具有保护膜和MEMS麦克风芯片的微机电系统（MEMS）麦克风公开(公告)号：US09264832B2
公开(公告)日：2016-02-16
申请号：US14066712
申请日：2013-10-30
Applicant: Solid State System Co., Ltd.
Inventor： Cheng-Wei Tsai , Chien-Hsing Lee , Jhyy-Cheng Liou
CPC classification number: H04R31/00 , H01L2224/48137 , H01L2924/16151 , H01L2924/16152 , H04R19/005 , H04R2201/003
Abstract: A method to protect an acoustic port of a microelectromechanical system (MEMS) microphone is provided. The method includes: providing the MEMS microphone; and forming a protection film, on the acoustic port of the MEMS microphone. The protection film has a porous region over the acoustic port to receive an acoustic signal but resist at least an intruding material. The protection film can at least endure a processing temperature of solder flow.
Abstract translation: 提供了保护微机电系统（MEMS）麦克风的声学端口的方法。 该方法包括：提供MEMS麦克风; 并在MEMS麦克风的声学端口上形成保护膜。 保护膜在声学端口上方具有多孔区域以接收声信号，但是至少阻挡入侵材料。 保护膜至少可以承受焊料流动的处理温度。
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