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公开(公告)号：US20200068317A1
公开(公告)日：2020-02-27
申请号：US16112777
申请日：2018-08-27
Applicant: Solid State System Co., Ltd.
Inventor： Tsung-Min Hsieh , Li-Chi Tsao , Chien-Hsing Lee , Jhyy-Cheng Liou
Abstract: A structure of micro-electro-mechanical-system (MEMS) microphone package includes a packaging substrate and an integrated circuit disposed on the packaging substrate. In addition, a MEMS microphone is disposed on the packaging substrate, wherein the MEMS microphone is electrically connected to the integrated circuit. A conductive adhesion layer is disposed on the packaging substrate, surrounding the integrated circuit and the MEMS microphone. A cap structure has a bottom part being adhered to the conductive adhesion layer. An underfill layer is disposed on the packaging substrate, covering an outer side of the conductive adhesion layer.
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公开(公告)号：US20190124452A1
公开(公告)日：2019-04-25
申请号：US16223124
申请日：2018-12-18
Applicant: Solid State System Co., Ltd.
Inventor： Tsung-Min Hsieh , Chien-Hsing Lee , Cheng-Wei Tsai
CPC classification number: H04R19/04 , B81B3/001 , B81B3/007 , B81B2201/0257 , B81B2203/0127 , B81C1/00984 , H04R31/003 , H04R2201/003
Abstract: A Micro-Electro-Mechanical Systems (MEMS) device includes a substrate, a dielectric supporting layer, a diaphragm, a backplate. The substrate has a substrate opening corresponding to a diaphragm region. The dielectric supporting layer is disposed on the substrate, having a dielectric opening corresponding to the substrate opening to form the diaphragm region. The diaphragm within the dielectric opening is held by the dielectric supporting layer at a periphery. The backplate is disposed on the dielectric supporting layer, having a plurality of venting holes, connecting to the dielectric opening. The backplate includes a conductive layer and a passivation layer covering over the conductive layer at a first side opposite to the diaphragm, wherein a second side of the conductive layer is facing to the diaphragm and not covered by the passivation layer.
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3.发明授权公开(公告)号：US09126827B2
公开(公告)日：2015-09-08
申请号：US14603371
申请日：2015-01-23
Applicant: Solid State System Co., Ltd.
Inventor： Tsung-Min Hsieh , Chien-Hsing Lee , Jhyy-Cheng Liou
CPC classification number: B81C1/00158 , B81B3/00 , B81B3/0013 , B81B7/00 , B81B2201/0257 , B81C1/00 , B81C1/00952 , H04R19/005 , H04R2201/003
Abstract: A method for fabricating MEMS device includes providing a silicon substrate. A structural dielectric layer is formed over a first side of the silicon substrate. Structure elements are embedded in the structural dielectric layer. The structure elements include a conductive backplate disposed over the silicon substrate, having venting holes and protrusion structures on top of the conductive backplate; and diaphragm located above the conductive backplate by a distance. A chamber is formed between the diaphragm and the conductive backplate. A cavity is formed in the silicon substrate at a second side. The cavity corresponds to the structure elements. An isotropic etching is performed on a dielectric material of the structural dielectric layer to release the structure elements. A first side of the diaphragm is exposed by the chamber and faces to the protrusion structures of the conductive backplate. A second side of the diaphragm is exposed to an environment space.
Abstract translation: 制造MEMS器件的方法包括提供硅衬底。 在硅衬底的第一侧上形成结构介电层。 结构元件嵌入在结构介电层中。 结构元件包括设置在硅衬底上的导电背板，在导电背板的顶部上具有通气孔和突出结构; 和隔膜位于导电背板上方一段距离。 在隔膜和导电背板之间形成一个室。 在第二侧的硅衬底中形成腔体。 空腔对应于结构元件。 对结构介电层的电介质材料进行各向同性蚀刻以释放结构元件。 隔膜的第一侧被室暴露，并面向导电背板的突出结构。 隔膜的第二面暴露于环境空间。
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4.发明授权公开(公告)号：US08673732B2
公开(公告)日：2014-03-18
申请号：US13906340
申请日：2013-05-31
Applicant: Solid State System Co., Ltd.
Inventor： Tsung-Min Hsieh , Chien-Hsing Lee , Jhyy-Cheng Liou
IPC: H01L21/76
CPC classification number: B81C1/00698 , B81C1/00682 , H01G5/18 , H04R19/005 , H04R19/04
Abstract: Method is to fabricate a MEMS device with a substrate. The substrate has through holes in the substrate within a diaphragm region and optionally an indent space from the second surface at the diaphragm region. A first dielectric structural layer is then disposed over the substrate from the first surface, wherein the first dielectric structural layer has a plurality of openings corresponding to the through holes, wherein each of the through holes remains exposed by the first dielectric structural layer. A second dielectric structural layer with a chamber is disposed over the first dielectric structural layer, wherein the chamber exposes the openings of the first dielectric structural layer and the through holes of the substrate to connect to the indent space. A MEMS diaphragm is embedded in the second dielectric structural layer above the chamber, wherein an air gap is formed between the substrate and the MEMS diaphragm.
Abstract translation: 方法是制造具有衬底的MEMS器件。 衬底在膜片区域内的衬底中具有通孔，并且可选地在隔膜区域处具有与第二表面相邻的凹陷空间。 然后，第一介电结构层从第一表面设置在衬底上，其中第一介电结构层具有对应于通孔的多个开口，其中每个通孔保持被第一介电结构层暴露。 具有腔室的第二电介质结构层设置在第一介电结构层上，其中腔室暴露第一介电结构层的开口和衬底的通孔以连接到凹陷空间。 MEMS隔膜嵌入在腔室上方的第二电介质结构层中，其中在衬底和MEMS隔膜之间形成气隙。
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公开(公告)号：US20210195340A1
公开(公告)日：2021-06-24
申请号：US16719941
申请日：2019-12-18
Applicant: Solid State System Co., Ltd.
Inventor： Tsung-Min Hsieh , Cheng-Wei Tsai , Chien-Hsing Lee
Abstract: In an embodiment, the invention provides a structure of MEMS microphone includes a substrate of semiconductor, having a first opening in the substrate. A dielectric layer is disposed on the substrate, having a dielectric opening. A diaphragm is within the dielectric opening and held by the dielectric layer at a peripheral region, wherein the diaphragm has a diaphragm opening. A back-plate is disposed on the dielectric layer, over the diaphragm. A protruding structure is disposed on the back-plate, protruding toward the diaphragm. At least one air valve plate is affixed on an end of the protruding structure within the diaphragm opening of the diaphragm. The air valve plate is activated when suffering an air flow with a pressure.
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Patent Agency Ranking
公开(公告)号：US11206495B2
公开(公告)日：2021-12-21
申请号：US16677622
申请日：2019-11-07
Applicant: Solid State System Co., Ltd.
Inventor： Tsung-Min Hsieh , Li-Chi Tsao , Chien-Hsing Lee
Abstract: A MEMS microphone includes a substrate. A dielectric layer is disposed on the substrate, having an opening and includes: indent region surrounding the opening; pillars extending from an indent surface at the indent region to the substrate; and an outer part surrounding the indent region and disposed on the substrate. A signal sensing space is created at the indent region between the pillars and between the pillars and the outer part. A first electrode layer is disposed on the indent surface of the dielectric layer. A second electrode layer is disposed on the substrate. A sensing diaphragm is held by the dielectric layer, including two elastic diaphragms supported by the dielectric layer; and a conductive plate between the first elastic diaphragm and the second elastic diaphragm. The conductive plate has a central part embedded in the holding structure and a peripheral part extending into the signal sensing space.
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7.发明申请公开(公告)号：US20210276857A1
公开(公告)日：2021-09-09
申请号：US16812395
申请日：2020-03-09
Applicant: Solid State System Co., Ltd.
Inventor： Cheng-Wei Tsai , Tsung-Min Hsieh , Chien-Hsing Lee
Abstract: The invention provides a MEMS microphone. The MEMS microphone includes a substrate, having a first opening. A dielectric layer is disposed on the substrate, wherein the dielectric layer has a second opening aligned to the first opening. A diaphragm is disposed within the second opening of the dielectric layer, wherein a peripheral region of the diaphragm is embedded into the dielectric layer at sidewall of the second opening. A backplate layer is disposed on the dielectric layer and covering over the second opening. The backplate layer includes a plurality of acoustic holes arranged into a regular array pattern. The regular array pattern comprises a pattern unit, the pattern unit comprises one of the acoustic holes as a center hole, and peripheral holes of the acoustic holes surrounding the center hole with a same pitch to the center hole.
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公开(公告)号：US10728674B2
公开(公告)日：2020-07-28
申请号：US16112777
申请日：2018-08-27
Applicant: Solid State System Co., Ltd.
Inventor： Tsung-Min Hsieh , Li-Chi Tsao , Chien-Hsing Lee , Jhyy-Cheng Liou
Abstract: A structure of micro-electro-mechanical-system (MEMS) microphone package includes a packaging substrate and an integrated circuit disposed on the packaging substrate. In addition, a MEMS microphone is disposed on the packaging substrate, wherein the MEMS microphone is electrically connected to the integrated circuit. A conductive adhesion layer is disposed on the packaging substrate, surrounding the integrated circuit and the MEMS microphone. A cap structure has a bottom part being adhered to the conductive adhesion layer. An underfill layer is disposed on the packaging substrate, covering an outer side of the conductive adhesion layer.
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公开(公告)号：US10250998B2
公开(公告)日：2019-04-02
申请号：US15335420
申请日：2016-10-26
Applicant: Solid State System Co., Ltd.
Inventor： Tsung-Min Hsieh , Chien-Hsing Lee , Cheng-Wei Tsai
Abstract: A Micro-Electro-Mechanical Systems (MEMS) device includes a substrate, a dielectric supporting layer, a diaphragm, a backplate. The substrate has a substrate opening corresponding to a diaphragm region. The dielectric supporting layer is disposed on the substrate, having a dielectric opening corresponding to the substrate opening to form the diaphragm region. The diaphragm within the dielectric opening is held by the dielectric supporting layer at a periphery. The backplate is disposed on the dielectric supporting layer, having a plurality of venting holes, connecting to the dielectric opening. The backplate includes a conductive layer and a passivation layer covering over the conductive layer at a first side opposite to the diaphragm, wherein a second side of the conductive layer is facing to the diaphragm and not covered by the passivation layer.
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公开(公告)号：US09321635B2
公开(公告)日：2016-04-26
申请号：US14092929
申请日：2013-11-28
Applicant: Solid State System Co., Ltd.
Inventor： Tsung-Min Hsieh , Chien-Hsing Lee , Jhyy-Cheng Liou
CPC classification number: B81C1/00928 , B81C1/00476
Abstract: A method for releasing a diaphragm of a micro-electro-mechanical systems (MEMS) device at a stage of semi-finished product. The method includes pre-wetting the MEMS device in a pre-wetting solution to at least pre-wet a sidewall surface of a cavity of the MEMS device. Then, a wetting process after the step of pre-wetting the MEMS device is performed to etch a dielectric material of a dielectric layer for holding the diaphragm, wherein a sensing portion of the diaphragm is released from the dielectric layer.
Abstract translation: 一种在半成品阶段释放微电子机械系统（MEMS）装置的隔膜的方法。 该方法包括将预先润湿溶液中的MEMS器件预润湿至少预先润湿MEMS器件的空腔的侧壁表面。 然后，执行在预先润湿MEMS器件的步骤之后的润湿过程，以蚀刻用于保持隔膜的电介质层的电介质材料，其中隔膜的感测部分从电介质层释放。
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