Invention Grant
US09324799B2 FinFET structures having uniform channel size and methods of fabrication
有权
FinFET结构具有均匀的通道尺寸和制造方法
- Patent Title: FinFET structures having uniform channel size and methods of fabrication
- Patent Title (中): FinFET结构具有均匀的通道尺寸和制造方法
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Application No.: US14480974Application Date: 2014-09-09
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Publication No.: US09324799B2Publication Date: 2016-04-26
- Inventor: Min Gyu Sung , Kwan-Yong Lim , Sukwon Hong
- Applicant: GLOBALFOUNDRIES Inc.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES INC.
- Current Assignee: GLOBALFOUNDRIES INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Heslin Rothenberg Farley and Mesiti PC
- Agent Nicholas Mesiti
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L21/336 ; H01L29/10 ; H01L29/66 ; H01L21/762 ; H01L29/36 ; H01L27/092 ; H01L21/8238 ; H01L29/06

Abstract:
Methods of fabricating circuit structures including FinFET structures are provided, including: providing a substrate and a first material having a first threshold voltage above the substrate, and a second material having a second threshold voltage lower than the first threshold voltage above the first material; forming fins having base fin portions formed from the first material and upper fin portions formed from the second material; providing gate structures over the fins to form one or more FinFET structures, wherein the gate structures wrap around at least the upper fin portions and have an operating voltage lower than the first threshold voltage and higher than the second threshold voltage, so that the upper fin portions define a channel size of the one or more FinFET structures. Circuit structures including FinFET structures are also provided, in which the FinFET structures have a uniform channel size defined only by upper fin portions thereof.
Public/Granted literature
- US20160071932A1 FINFET STRUCTURES HAVING UNIFORM CHANNEL SIZE AND METHODS OF FABRICATION Public/Granted day:2016-03-10
Information query
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