Invention Grant
- Patent Title: Gate-all-around semiconductor device and method of fabricating the same
- Patent Title (中): 全栅半导体器件及其制造方法
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Application No.: US14671134Application Date: 2015-03-27
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Publication No.: US09324818B2Publication Date: 2016-04-26
- Inventor: Niamh Waldron , Clement Merckling , Nadine Collaert
- Applicant: IMEC VZW
- Applicant Address: BE Leuven
- Assignee: IMEC VZW
- Current Assignee: IMEC VZW
- Current Assignee Address: BE Leuven
- Agency: Knobbe, Martens, Olson & Bear LLP
- Priority: EP14162027 20140327
- Main IPC: H01L29/41
- IPC: H01L29/41 ; B82Y10/00 ; B82Y40/00 ; H01L29/66 ; H01L29/775 ; H01L29/06 ; H01L29/10 ; H01L29/20 ; H01L29/04 ; H01L29/423 ; H01L29/78

Abstract:
The disclosed technology generally relates to semiconductor devices and more particularly to a gate-all-around semiconductor device, and methods of fabricating the same. In one aspect, the method comprises providing on a semiconductor substrate between STI regions at least one suspended nanostructure anchored by a source region and a drain region. The suspended nanostructure is formed of a crystalline semiconductor material that is different from a crystalline semiconductor material of the semiconductor substrate. A gate stack surrounds the at least one suspended nanostructure.
Public/Granted literature
- US20150279947A1 GATE-ALL-AROUND SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME Public/Granted day:2015-10-01
Information query
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