Invention Grant
- Patent Title: Enameled flat wire
- Patent Title (中): 漆包扁线
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Application No.: US14223618Application Date: 2014-03-24
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Publication No.: US09330817B2Publication Date: 2016-05-03
- Inventor: Masayoshi Goto
- Applicant: Hitachi Metals, Ltd.
- Applicant Address: JP Tokyo
- Assignee: Hitachi Metals, Ltd.
- Current Assignee: Hitachi Metals, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Crowell & Moring LLP
- Priority: JP2010-002605 20100108
- Main IPC: H01B7/00
- IPC: H01B7/00 ; H01B7/08 ; C03C25/12 ; B05C3/12 ; H01B13/16 ; C03C25/18 ; B05C1/04 ; B05D7/20 ; H01B13/06 ; H01B13/24

Abstract:
An enameled flat wire includes a flat wire and an enamel coating. The difference in thickness of the enamel coating on flat surfaces between a maximum thickness and a minimum thickness is equal to or less than 25% of the predetermined thickness. The enamel coating prior to baking includes a maximum surface curvature on each of the rounded corners of the wire, and a depression on at least one of the flat surfaces of the wire, the depression has a maximum surface curvature. The maximum surface curvature of the depression is larger than the maximum surface curvature of the enamel coating prior to baking on at least one of the rounded corners thereof.
Public/Granted literature
- US20140202731A1 ENAMELED FLAT WIRE Public/Granted day:2014-07-24
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