Invention Grant
- Patent Title: Semiconductor module
- Patent Title (中): 半导体模块
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Application No.: US13819209Application Date: 2010-09-02
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Publication No.: US09331001B2Publication Date: 2016-05-03
- Inventor: Takuya Kadoguchi , Yoshikazu Suzuki , Masaya Kaji , Kiyofumi Nakajima , Tatsuya Miyoshi , Takanori Kawashima , Tomomi Okumura
- Applicant: Takuya Kadoguchi , Yoshikazu Suzuki , Masaya Kaji , Kiyofumi Nakajima , Tatsuya Miyoshi , Takanori Kawashima , Tomomi Okumura
- Applicant Address: JP Toyota-Shi
- Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
- Current Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
- Current Assignee Address: JP Toyota-Shi
- Agency: Kenyon & Kenyon LLP
- International Application: PCT/JP2010/065062 WO 20100902
- International Announcement: WO2012/029165 WO 20120308
- Main IPC: H01L23/40
- IPC: H01L23/40 ; H01L23/31 ; H01L23/373 ; H01L23/433 ; H01L23/473 ; H01L23/495 ; H01L25/07 ; H01L23/00
Abstract:
A semiconductor module includes a semiconductor device; a metal plate portion that includes a first surface on a side of the semiconductor device and has a fastening portion at an end thereof; a molded portion that is formed by molding a resin on the semiconductor device and the metal plate portion, a cooling plate portion that is a separate member from the metal plate portion, is provided on a side opposite to the first surface on the side of the semiconductor device, and includes fins on a side opposite to the side of the metal plate portion; wherein the fastening portion of the metal plate portion is exposed out of the molded portion, and the cooling plate portion includes a fastening portion at a position that corresponds to a position of the fastening portion of the metal plate portion.
Public/Granted literature
- US20130154084A1 SEMICONDUCTOR MODULE Public/Granted day:2013-06-20
Information query
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