Invention Grant
- Patent Title: Semiconductor die laminating device with independent drives
- Patent Title (中): 具有独立驱动器的半导体模具贴合装置
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Application No.: US14399495Application Date: 2012-05-07
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Publication No.: US09331045B2Publication Date: 2016-05-03
- Inventor: Wei Gu , Zhong Lu , Cheeman Yu , Chin-Tien Chiu , En-Yong Tai , Min Ni
- Applicant: Wei Gu , Zhong Lu , Cheeman Yu , Chin-Tien Chiu , En-Yong Tai , Min Ni
- Applicant Address: CN Shanghai CN Shanghai
- Assignee: SanDisk Information Technology (Shanghai) Co., Ltd.,SanDisk Semiconductor (Shanghai) Co., Ltd.
- Current Assignee: SanDisk Information Technology (Shanghai) Co., Ltd.,SanDisk Semiconductor (Shanghai) Co., Ltd.
- Current Assignee Address: CN Shanghai CN Shanghai
- Agency: Vierra Magen Marcus LLP
- International Application: PCT/CN2012/075126 WO 20120507
- International Announcement: WO2013/166641 WO 20131104
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/544 ; H01L23/31 ; H01L21/56 ; H01L25/065
Abstract:
A laminating device (230) and method are disclosed for laminating semiconductor die (220) on substrates on a panel (200) of substrates. The laminating device (230) includes lamination units (234,236,238,240) that operate independently of each other so that a row or column of semiconductor die (220) may be independently laminated onto a row or column of substrates simultaneously.
Public/Granted literature
- US20150115479A1 SEMICONDUCTOR DIE LAMINATING DEVICE WITH INDEPENDENT DRIVES Public/Granted day:2015-04-30
Information query
IPC分类:
