Invention Grant
- Patent Title: Solderless battery contact
- Patent Title (中): 无焊接电池触点
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Application No.: US14041253Application Date: 2013-09-30
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Publication No.: US09331315B1Publication Date: 2016-05-03
- Inventor: Jason Evans Goulden , Manuel Rinley Deeds, III , Mi Zhou , Shelomon Patrick Doblack
- Applicant: AMAZON TECHNOLOGIES, INC.
- Applicant Address: US NV Reno
- Assignee: Amazon Technologies, Inc.
- Current Assignee: Amazon Technologies, Inc.
- Current Assignee Address: US NV Reno
- Agency: Lindauer Law, PLLC
- Main IPC: H01M2/10
- IPC: H01M2/10 ; H01M2/20

Abstract:
Described in this disclosure are battery contacts for use in electronic devices usable without soldering to a circuit board. The battery contact includes one or more contact features supported by leaf springs. The contact features touch a corresponding pad on the circuit board at time of assembly, providing an electrically conductive pathway. One or more of the battery contacts may include a spring-biased member configured to apply pressure to one or more batteries.
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