Invention Grant
- Patent Title: Lead-free solder composition for glass
- Patent Title (中): 玻璃无铅焊料组成
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Application No.: US13712326Application Date: 2012-12-12
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Publication No.: US09333594B2Publication Date: 2016-05-10
- Inventor: Hae Won Jeong , Hyun Dal Park , Tae Seung Lee , Seung Kyu Kim , Hong Nho Joo , Ho June Yoon , Min Ho Bak , Joo Dong Lee , Hyun Chae Jung , Sun Myung Lee
- Applicant: Hyundai Motor Company , Kia Motors Corporation , Korea Autoglass Corporation , Heesung Material Ltd.
- Applicant Address: KR Seoul KR Seoul KR Yeongi, Chungcheongnam-do KR Yongin, Gyeonggi-do
- Assignee: Hyundai Motor Company,Kia Motors Corporation,Korea Autoglass Corporation,Heesung Material Ltd.
- Current Assignee: Hyundai Motor Company,Kia Motors Corporation,Korea Autoglass Corporation,Heesung Material Ltd.
- Current Assignee Address: KR Seoul KR Seoul KR Yeongi, Chungcheongnam-do KR Yongin, Gyeonggi-do
- Agency: Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.
- Agent Peter F. Corless
- Priority: KR10-2012-0088178 20120813
- Main IPC: B23K35/14
- IPC: B23K35/14 ; B23K35/24 ; B23K35/02 ; B23K35/26
Abstract:
The present invention provides a lead-free solder composition for glass. The lead-free solder composition for glass includes indium, zinc, and tin. The indium (In) ranges from about 30.0 wt % to about 60 wt %. The zinc (Zn) ranges from about 0.01 wt % to about 11.0 wt %. The tin (Sn) is included as a remaining component.
Public/Granted literature
- US20140044589A1 LEAD-FREE SOLDER COMPOSITION FOR GLASS Public/Granted day:2014-02-13
Information query
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