Invention Grant
- Patent Title: Chip package and method thereof
- Patent Title (中): 芯片封装及其方法
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Application No.: US14747507Application Date: 2015-06-23
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Publication No.: US09334156B2Publication Date: 2016-05-10
- Inventor: Chien-Min Lin , Yu-Ting Huang , Chen-Ning Fu , Yen-Shih Ho
- Applicant: XINTEC INC.
- Applicant Address: TW Taoyuan
- Assignee: XINTEC INC.
- Current Assignee: XINTEC INC.
- Current Assignee Address: TW Taoyuan
- Agency: Liu & Liu
- Priority: TW103127488A 20140811
- Main IPC: B81B7/00
- IPC: B81B7/00 ; B81C1/00 ; H01L21/48 ; H01L23/498

Abstract:
A chip package includes a semiconductor chip, an interposer, a polymer adhesive supporting layer, a redistribution layer and a packaging layer. The semiconductor chip has a sensor device and a conductive pad electrically connected to the sensing device, and the interposer is disposed on the semiconductor chip. The interposer has a trench and a through hole, which the trench exposes a portion of the sensing device, and the through hole exposes the conductive pad. The polymer adhesive supporting layer is interposed between the semiconductor chip and the interposer, and the redistribution layer is disposed on the interposer and in the through hole to be electrically connected to the conductive pad. The packaging layer covers the interposer and the redistribution layer, which the packaging layer has an opening exposing the trench.
Public/Granted literature
- US20160039662A1 CHIP PACKAGE AND METHOD THEREOF Public/Granted day:2016-02-11
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