Invention Grant
US09334694B2 Polycrystalline diamond compacts with partitioned substrate, polycrystalline diamond table, or both
有权
具有分隔的基底，多晶金刚石台或两者的多晶金刚石压块
- Patent Title: Polycrystalline diamond compacts with partitioned substrate, polycrystalline diamond table, or both
- Patent Title (中): 具有分隔的基底，多晶金刚石台或两者的多晶金刚石压块
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Application No.: US14452206Application Date: 2014-08-05
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Publication No.: US09334694B2Publication Date: 2016-05-10
- Inventor: Jair J. Gonzalez , Kenneth E. Bertagnolli , Debkumar Mukhopadhyay , David P. Miess , Mark P. Chapman , Ronald W. Ward , Nicholas Christensen , Damon B. Crockett , Mohammad N. Sani
- Applicant: US SYNTHETIC CORPORATION
- Applicant Address: US UT Orem
- Assignee: US SYNTHETIC CORPORATION
- Current Assignee: US SYNTHETIC CORPORATION
- Current Assignee Address: US UT Orem
- Agency: Dorsey & Whitney LLP
- Main IPC: E21B10/56
- IPC: E21B10/56 ; F16C33/04 ; E21B10/567 ; E21B10/55
Abstract:
Methods for at least partially relieving stress within a polycrystalline diamond (“PCD”) table of a polycrystalline diamond compact (“PDC”) include partitioning the substrate of the PDC, the PCD table of the PDC, or both. Partitioning may be achieved through grinding, machining, laser cutting, electro-discharge machining, or combinations thereof. PDCs may include at least one stress relieving partition.
Public/Granted literature
- US20140367177A1 POLYCRYSTALLINE DIAMOND COMPACTS WITH PARTITIONED SUBSTRATE, POLYCRYSTALLINE DIAMOND TABLE, OR BOTH Public/Granted day:2014-12-18
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