Disclosed herein is a ceramic board and the manufacturing method and an image sensor package and a manufacturing method thereof, the ceramic board including a ceramic body in which an upper surface is formed with a first groove, a second groove is formed in the first groove, and the second groove is formed with a through hole; a first electrode pad formed in the first groove; and a second electrode pad formed at any one of the upper surface, a lower surface and the both surfaces of the ceramic body, electrically connected to the first electrode pad.