Invention Grant
- Patent Title: E-fuse structure with methods of fusing the same and monitoring material leakage
- Patent Title (中): 电熔丝结构采用熔接方法和监测材料的泄漏
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Application No.: US14165039Application Date: 2014-01-27
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Publication No.: US09337143B2Publication Date: 2016-05-10
- Inventor: O Sung Kwon , Dan Moy , Kihwang Son , Xiaoqiang Zhang
- Applicant: International Business Machines Corporation , GLOBALFOUNDRIES Inc. , Samsung Electronics Co., Ltd.
- Applicant Address: KY Grand Cayman KR Gyeonggi-Do US NY Armonk
- Assignee: GlobalFoundries Inc.,Samsung Electronics Co., Ltd.,International Business Machines Corporation
- Current Assignee: GlobalFoundries Inc.,Samsung Electronics Co., Ltd.,International Business Machines Corporation
- Current Assignee Address: KY Grand Cayman KR Gyeonggi-Do US NY Armonk
- Agency: Hoffman Warnick LLC
- Agent Steven J. Meyers
- Main IPC: H01L23/525
- IPC: H01L23/525 ; H01L21/321 ; H01L23/367 ; H01L23/532 ; G01R31/28 ; H01L21/66
Abstract:
The present disclosure generally provides for an e-fuse structure and corresponding method for fusing the same and monitoring material leakage. The e-fuse structure can include a metal dummy structure and an electrical fuse link substantially aligned with a portion of the metal dummy structure, wherein the metal dummy structure cools at least part of the electrical fuse link in response to an electric current passing through the electrical fuse link.
Public/Granted literature
- US20150214149A1 E-FUSE STRUCTURE WITH METHODS OF FUSING THE SAME AND MONITORING MATERIAL LEAKAGE Public/Granted day:2015-07-30
Information query
IPC分类:
