Invention Grant
US09337161B2 Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereof
有权
集成电路封装系统，其具有带电镀端子引线的可拆卸背衬元件及其制造方法
- Patent Title: Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereof
- Patent Title (中): 集成电路封装系统，其具有带电镀端子引线的可拆卸背衬元件及其制造方法
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Application No.: US14340436Application Date: 2014-07-24
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Publication No.: US09337161B2Publication Date: 2016-05-10
- Inventor: Zigmund R. Camacho , Dioscoro A. Merilo , Henry Descalzo Bathan , Lionel Chien Hui Tay
- Applicant: STATS ChipPAC, Ltd.
- Applicant Address: SG Singapore
- Assignee: STATS ChipPAC, Ltd.
- Current Assignee: STATS ChipPAC, Ltd.
- Current Assignee Address: SG Singapore
- Agency: Atkins and Associates, P.C.
- Agent Robert D. Atkins
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/00 ; H01L21/56 ; H01L23/31 ; H01L25/065 ; H01L25/10 ; H01L23/28 ; H01L21/683
Abstract:
A method of manufacture of an integrated circuit package system includes: attaching a first die to a first die pad; connecting electrically a second die to the first die through a die interconnect positioned between the first die and the second die; connecting a first lead adjacent the first die pad to the first die; connecting a second lead to the second die, the second lead opposing the first lead and adjacent the second die; and providing a molding material around the first die, the second die, the die interconnect, the first lead and the second lead, with a portion of the first lead exposed.
Public/Granted literature
Information query
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