Invention Grant
- Patent Title: Electronic component, a semiconductor wafer and a method for producing an electronic component
- Patent Title (中): 电子部件，半导体晶片和电子部件的制造方法
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Application No.: US14225652Application Date: 2014-03-26
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Publication No.: US09337311B2Publication Date: 2016-05-10
- Inventor: Friedrich Kroener
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Dicke, Billig & Czaja, PLLC
- Main IPC: H01L21/762
- IPC: H01L21/762 ; H01L21/763 ; H01L29/66 ; H01L29/06 ; H01L29/739 ; H01L29/78 ; H01L23/00 ; H01L29/08 ; H01L29/417 ; H01L29/45
Abstract:
An electronic component includes a semiconductor substrate defined by a generally planar first face, a generally planar second face and side faces extending between the generally planar second face and the generally planar first face. The semiconductor substrate has a curved contour between the generally planar second face and the side faces.
Public/Granted literature
- US20140206163A1 ELECTRONIC COMPONENT, A SEMICONDUCTOR WAFER AND A METHOD FOR PRODUCING AN ELECTRONIC COMPONENT Public/Granted day:2014-07-24
Information query
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