Invention Grant
- Patent Title: FinFET spacer formation by oriented implantation
-
Application No.: US14157851Application Date: 2014-01-17
-
Publication No.: US09337315B2Publication Date: 2016-05-10
- Inventor: Veeraraghavan S. Basker , Kangguo Cheng , Bruce B. Doris , Johnathan E. Faltermeier
- Applicant: GLOBALFOUNDRIES INC.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES INC.
- Current Assignee: GLOBALFOUNDRIES INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Thompson Hine LLP
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L21/8234 ; H01L21/265 ; H01L29/78

Abstract:
A FinFET having spacers with a substantially uniform profile along the length of a gate stack which covers a portion of a fin of semiconductor material formed on a substrate is provided by depositing spacer material conformally on both the fins and gate stack and performing an angled ion impurity implant approximately parallel to the gate stack to selectively cause damage to only spacer material deposited on the fin. Due to the damage caused by the angled implant, the spacer material on the fins can be etched with high selectivity to the spacer material on the gate stack.
Public/Granted literature
- US20140131801A1 FINFET SPACER FORMATION BY ORIENTED IMPLANTATION Public/Granted day:2014-05-15
Information query
IPC分类: