Invention Grant
- Patent Title: Light emitting device package
- Patent Title (中): 发光装置封装
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Application No.: US14149547Application Date: 2014-01-07
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Publication No.: US09337403B2Publication Date: 2016-05-10
- Inventor: Byung Mok Kim , Hiroshi Kodaira , Ha Na Kim , Yuichiro Tanda , Satoshi Ozeki
- Applicant: LG INNOTEK CO., LTD.
- Applicant Address: KR Seoul
- Assignee: LG INNOTEK CO., LTD.
- Current Assignee: LG INNOTEK CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: KR10-2013-0002145 20130108
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L33/58 ; H01L33/48 ; H01L33/56

Abstract:
Disclosed is a light emitting device package with improved light extraction efficiency. The light emitting device package includes a substrate, a light emitting device disposed on the substrate, and a light transmission unit disposed above the light emitting device, the light transmission unit being spaced from the light emitting device, wherein a distance between an upper surface of the light emitting device and the light transmission unit is 0.15 mm to 0.35 mm.
Public/Granted literature
- US20140191276A1 LIGHT EMITTING DEVICE PACKAGE Public/Granted day:2014-07-10
Information query
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