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公开(公告)号：US10396247B2
公开(公告)日：2019-08-27
申请号：US15319486
申请日：2015-06-08
Applicant: LG INNOTEK CO., LTD.
Inventor： Byung Mok Kim , Hiroshi Kodaira , Baek Jun Kim , Ha Na Kim , Jung Woo Lee , Sang Ung Hwang
Abstract: A light-emitting device package of the embodiments includes a package body; at least one light emitting device above the package body; an adhesive layer between the at least one light emitting device and the package body; and an adhesive-layer-accommodating portion disposed in the package body for accommodating the adhesive layer therein, wherein the adhesive-layer-accommodating portion has a side surface disposed to be inclined at a predetermined angle relative to an imaginary vertical plane that extends in a thickness direction of the package body.
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公开(公告)号：US09842975B2
公开(公告)日：2017-12-12
申请号：US15082091
申请日：2016-03-28
Applicant: LG Innotek Co., Ltd.
Inventor： Byung Mok Kim , Bo Hee Kang , Ha Na Kim , Hiroshi Kodaira , Yuichiro Tanda , Satoshi Ozeki
CPC classification number: H01L33/62 , A61L2/08 , A61L2/10 , H01L33/38 , H01L33/483 , H01L33/486 , H01L33/641 , H01L33/642 , H01L2224/48091 , H01L2224/48227 , H01L2924/15174 , H01L2924/00014
Abstract: A light emitting device package including a package body including a first cavity and a second cavity, a pad disposed on a bottom surface of the first cavity, a light emitting device disposed on the second cavity electrically connected to the pad, a heat dissipation member inserted into the package body, the heat dissipation member including a body and expanded portions disposed at a partial edge region of the body and electrode patterns disposed at the package body, wherein the package body has an upper portion and a lower portion disposed under the upper portion, wherein the first cavity including side surfaces and a bottom surface, wherein the second cavity provided in the bottom surface of the first cavity.
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公开(公告)号：US08872195B2
公开(公告)日：2014-10-28
申请号：US14275725
申请日：2014-05-12
Applicant: LG Innotek Co., Ltd.
Inventor： Byung Mok Kim , Bo Hee Kang , Ha Na Kim , Hiroshi Kodaira , Yuichiro Tanda , Satoshi Ozeki
CPC classification number: H01L33/62 , A61L2/08 , A61L2/10 , H01L33/38 , H01L33/483 , H01L33/486 , H01L33/641 , H01L33/642 , H01L2224/48091 , H01L2224/48227 , H01L2924/15174 , H01L2924/00014
Abstract: A light emitting device package including a package body including a plurality of first ceramic layers, at least one electrode pattern placed on the package body, at least one light emitting device electrically connected to the electrode pattern, and a heat dissipation member disposed in the package body to thermally come into contact with the light emitting device, wherein the heat dissipation member is provided with an expanded portion at a region corresponding to a boundary of different first ceramic layers.
Abstract translation: 一种发光器件封装，包括包括多个第一陶瓷层的封装体，放置在封装主体上的至少一个电极图案，与电极图形电连接的至少一个发光器件，以及设置在封装体中的散热构件 本体与发光器件热接触，其中散热构件在对应于不同第一陶瓷层的边界的区域处设置有扩展部分。
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公开(公告)号：USD762183S1
公开(公告)日：2016-07-26
申请号：US29524935
申请日：2015-04-24
Applicant: LG INNOTEK CO., LTD.
Designer： Byung Mok Kim , Hae Jin Park , Baek Jun Kim , Ha Na Kim
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公开(公告)号：US09337403B2
公开(公告)日：2016-05-10
申请号：US14149547
申请日：2014-01-07
Applicant: LG INNOTEK CO., LTD.
Inventor： Byung Mok Kim , Hiroshi Kodaira , Ha Na Kim , Yuichiro Tanda , Satoshi Ozeki
CPC classification number: H01L33/58 , H01L33/48 , H01L33/56 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014
Abstract: Disclosed is a light emitting device package with improved light extraction efficiency. The light emitting device package includes a substrate, a light emitting device disposed on the substrate, and a light transmission unit disposed above the light emitting device, the light transmission unit being spaced from the light emitting device, wherein a distance between an upper surface of the light emitting device and the light transmission unit is 0.15 mm to 0.35 mm.
Abstract translation: 公开了一种具有改进的光提取效率的发光器件封装。 发光器件封装包括衬底，设置在衬底上的发光器件和设置在发光器件上方的光传输单元，光传输单元与发光器件间隔开，其中， 发光装置和光传输单元为0.15mm至0.35mm。
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Patent Agency Ranking
公开(公告)号：US09076949B2
公开(公告)日：2015-07-07
申请号：US14496486
申请日：2014-09-25
Applicant: LG Innotek Co., Ltd.
Inventor： Byung Mok Kim , Bo Hee Kang , Ha Na Kim , Hiroshi Kodaira , Yuichiro Tanda , Satoshi Ozeki
CPC classification number: H01L33/62 , A61L2/08 , A61L2/10 , H01L33/38 , H01L33/483 , H01L33/486 , H01L33/641 , H01L33/642 , H01L2224/48091 , H01L2224/48227 , H01L2924/15174 , H01L2924/00014
Abstract: A light emitting device package including a package body, at least one electrode pattern placed on the package body, at least one light emitting device electrically connected to the electrode pattern, a heat dissipation member disposed in the package body to thermally come into contact with the light emitting device, and an anti-fracture layer placed on the heat dissipation member, wherein a width of the heat dissipation member is different at different heights of the package body.
Abstract translation: 一种发光器件封装，包括封装体，至少一个放置在封装主体上的电极图案，至少一个电连接到电极图案的发光器件;散热构件，其布置在封装主体中以与第 发光装置和放置在散热构件上的抗断裂层，其中散热构件的宽度在封装体的不同高度处不同。
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公开(公告)号：US20150102375A1
公开(公告)日：2015-04-16
申请号：US14484637
申请日：2014-09-12
Applicant: LG INNOTEK CO., LTD.
Inventor： Baek Jun KIM , Hiroshi Kodaira , Byung Mok Kim , Ha Na Kim , Yuichiro Tanda , Satoshi Ozeki
CPC classification number: H01L33/486 , H01L33/36 , H01L33/44 , H01L33/48 , H01L33/56 , H01L33/62 , H01L2224/48091 , H01L2224/48145 , H01L2224/49107 , H01L2224/73265 , H01L2924/16195 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
Abstract: A light emitting device package is disclosed. The light emitting device package includes a package body including at least one ceramic layer, a submount disposed at the package body, a light emitting device disposed on the submount for emitting ultraviolet (UV)-wavelength light, and an anti-reflection (AR) coating layer disposed around the light emitting device, the AR coating layer being formed of an inorganic coating layer.
Abstract translation: 公开了一种发光器件封装。 发光器件封装包括：包括至少一个陶瓷层的封装主体，设置在封装主体处的基座;布置在用于发射紫外线（UV） - 波长的光的基座上的发光器件，以及防反射（AR） 涂层设置在发光器件周围，AR涂层由无机涂层形成。
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公开(公告)号：US20150048262A1
公开(公告)日：2015-02-19
申请号：US14496486
申请日：2014-09-25
Applicant: LG Innotek Co., Ltd.
Inventor： Byung Mok Kim , Bo Hee Kang , Ha Na Kim , Hiroshi Kodaira , Yuichiro Tanda , Satoshi Ozeki
CPC classification number: H01L33/62 , A61L2/08 , A61L2/10 , H01L33/38 , H01L33/483 , H01L33/486 , H01L33/641 , H01L33/642 , H01L2224/48091 , H01L2224/48227 , H01L2924/15174 , H01L2924/00014
Abstract: A light emitting device package including a package body, at least one electrode pattern placed on the package body, at least one light emitting device electrically connected to the electrode pattern, a heat dissipation member disposed in the package body to thermally come into contact with the light emitting device, and an anti-fracture layer placed on the heat dissipation member, wherein a width of the heat dissipation member is different at different heights of the package body.
Abstract translation: 一种发光器件封装，其包括封装体，至少一个放置在封装主体上的电极图案，至少一个电连接到电极图案的发光器件;散热构件，其布置在封装主体中以与第 发光装置和放置在散热构件上的抗断裂层，其中散热构件的宽度在封装体的不同高度处不同。
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公开(公告)号：US09887324B2
公开(公告)日：2018-02-06
申请号：US14484637
申请日：2014-09-12
Applicant: LG INNOTEK CO., LTD.
Inventor： Baek Jun Kim , Hiroshi Kodaira , Byung Mok Kim , Ha Na Kim , Yuichiro Tanda , Satoshi Ozeki
CPC classification number: H01L33/486 , H01L33/36 , H01L33/44 , H01L33/48 , H01L33/56 , H01L33/62 , H01L2224/48091 , H01L2224/48145 , H01L2224/49107 , H01L2224/73265 , H01L2924/16195 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
Abstract: A light emitting device package is disclosed. The light emitting device package includes a package body including at least one ceramic layer, a submount disposed at the package body, a light emitting device disposed on the submount for emitting ultraviolet (UV)-wavelength light, and an anti-reflection (AR) coating layer disposed around the light emitting device, the AR coating layer being formed of an inorganic coating layer.
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10.发明授权公开(公告)号：US10714660B2
公开(公告)日：2020-07-14
申请号：US15319318
申请日：2015-05-27
Applicant: LG INNOTEK CO., LTD.
Inventor： Byung Mok Kim , Ha Na Kim , Hiroshi Kodaira , Baek Jun Kim , Jung Woo Lee , Sang Ung Hwang
Abstract: A light-emitting device package according to an embodiment includes a package body including a cavity and a recessed portion formed around the cavity, the recessed portion having at least one concave portion; at least one light-emitting device mounted in the cavity; a light-transmitting member disposed to cover a top of the cavity and configured to transmit light emitted from the at least one light-emitting device; and a bonding member accommodated in the at least one concave portion so as to allow the light-transmitting member and the package body to be bonded to each other in the recessed portion.
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