Invention Grant
- Patent Title: Feedforward temperature control for plasma processing apparatus
- Patent Title (中): 等离子体处理装置的前馈温度控制
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Application No.: US12905624Application Date: 2010-10-15
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Publication No.: US09338871B2Publication Date: 2016-05-10
- Inventor: Chetan Mahadeswaraswamy , Walter R. Merry , Sergio Fukuda Shoji , Chunlei Zhang , Yashaswini B. Pattar , Duy D. Nguyen , Tina Tsong , Shane C. Nevil , Douglas A. Buchberger, Jr. , Fernando M. Silveira , Brad L. Mays , Kartik Ramaswamy , Hamid Noorbakhsh
- Applicant: Chetan Mahadeswaraswamy , Walter R. Merry , Sergio Fukuda Shoji , Chunlei Zhang , Yashaswini B. Pattar , Duy D. Nguyen , Tina Tsong , Shane C. Nevil , Douglas A. Buchberger, Jr. , Fernando M. Silveira , Brad L. Mays , Kartik Ramaswamy , Hamid Noorbakhsh
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely Sokoloff Taylor & Zafman LLP
- Main IPC: G01L21/30
- IPC: G01L21/30 ; G01R31/00 ; H01L21/302 ; H01L21/461 ; H01L21/306 ; C23F1/00 ; H05H1/00 ; H01J37/32
Abstract:
Methods and systems for controlling temperatures in plasma processing chamber with reduced controller response times and increased stability. Temperature control is based at least in part on a feedforward control signal derived from a plasma power input into the processing chamber. A feedforward control signal compensating disturbances in the temperature attributable to the plasma power may be combined with a feedback control signal counteracting error between a measured and desired temperature.
Public/Granted literature
- US20110186545A1 FEEDFORWARD TEMPERATURE CONTROL FOR PLASMA PROCESSING APPARATUS Public/Granted day:2011-08-04
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