Invention Grant
- Patent Title: Probe card and manufacturing method thereof
- Patent Title (中): 探针卡及其制造方法
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Application No.: US13972930Application Date: 2013-08-22
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Publication No.: US09341648B2Publication Date: 2016-05-17
- Inventor: Chung-Tse Lee , Chien-Chou Wu , Tsung-Yi Chen , Ming-Chi Chen
- Applicant: MPI Corporation
- Applicant Address: TW Hsinchu County
- Assignee: MPI Corporation
- Current Assignee: MPI Corporation
- Current Assignee Address: TW Hsinchu County
- Agency: CKC & Partners Co., Ltd.
- Priority: TW101134326A 20120919
- Main IPC: G01R31/00
- IPC: G01R31/00 ; G01R1/04 ; G01R3/00 ; G01R1/073
Abstract:
The probe card includes a substrate, at least two IC boards, and a plurality of probe pads. The IC boards are located on the substrate, and a predetermined distance is formed between the IC boards. Each of the IC boards has a plurality of lead connection points. The probe pads are plated on the IC boards, and are respectively connected to the lead connection points to cover the lead connection points. A probe area is surrounded by the probe pads on each of the IC boards. The probe pads are used to abut against plural probes.
Public/Granted literature
- US20140077833A1 PROBE CARD AND MANUFACTURING METHOD THEREOF Public/Granted day:2014-03-20
Information query
