公开(公告)号：US20150033553A1

公开(公告)日：2015-02-05

申请号：US14515537

申请日：2014-10-16

Applicant: MPI CORPORATION

Inventor： Chien-Chou Wu ,  Ming-Chi Chen ,  Tsung-Yi Chen ,  Chung-Che Li

IPC: G01R3/00 ,  G01R31/28

CPC classification number: G01R3/00 ,  B23K2103/42 ,  G01R31/2853 ,  G01R31/2887 ,  G01R31/2889 ,  Y10T29/49004 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/49222

Abstract: An assembly method of direct-docking probing device is provided. First, a space transforming plate made by back-end-of-line semiconductor manufacturing process is provided, so the thickness of the space transforming plate is predetermined by the client of probe card manufacturer. Then a reinforcing plate in which a plurality of circuits disposed is provided, which has larger mechanical strength than the space transforming plate. After that the reinforcing plate and the space transforming plate are joined and electrically connected by a plurality of solders so as to form a space transformer. Then, a conductive elastic member and a probe interface board are provided. Thereafter, the space transformer and the conductive elastic member are mounted on the probe interface board. After that, at least one vertical probe assembly having a plurality of vertical probes is mounted on the space transforming plate, and the vertical probes is electrically connected with the space transforming plate.

Abstract translation: 提供了直接对接探测装置的装配方法。 首先，提供由后端半导体制造工艺制成的空间变换板，因此空间变换板的厚度由探针卡制造商的客户预先确定。 然后，设置有设置多个电路的加强板，其具有比空间转换板更大的机械强度。 之后，加强板和空间变换板通过多个焊料接合并电连接，形成空间变换器。 然后，提供导电弹性构件和探针接口板。 此后，空间变压器和导电弹性构件安装在探针接口板上。 之后，具有多个垂直探针的至少一个垂直探针组件安装在空间变换板上，垂直探针与空间转换板电连接。

公开(公告)号：US09618536B2

公开(公告)日：2017-04-11

申请号：US14294958

申请日：2014-06-03

Applicant: MPI CORPORATION

Inventor： Chia-Yuan Kuo ,  Tien-Chia Li ,  Ming-Chi Chen ,  Chien-Chou Wu ,  Tsung-Yi Chen

IPC: G01D11/00 ,  G01R1/073 ,  G01R1/067

CPC classification number: G01R1/07357 ,  G01R1/0675

Abstract: A probe needle includes a head, a tail and a body connected between the head and the tail and provided with a first flat section curvedly extending from the head towards the tail for providing sufficient deformation when the tail is pressed on a device under test, and a second flat section neighbored to the first flat section for supporting the probe needle in between upper and lower dies. When the probe needles are used in a probe module, the probe needles can be arranged with a pitch same as that of the conventional probe needles even though the probe needles are formed from posts having a relatively greater diameter than that of the posts for making the conventional probe needles, such that the probe needles may have enhanced current withstanding capacity and prolonged lifespan.

公开(公告)号：US20150185254A1

公开(公告)日：2015-07-02

申请号：US14656730

申请日：2015-03-13

Applicant: MPI Corporation

Inventor： Chien-Chou Wu ,  Ming-Chi Chen ,  Chung-Che Li

IPC: G01R3/00 ,  H01F41/00 ,  H01F38/20 ,  H05K3/32 ,  H05K3/24

CPC classification number: G01R3/00 ,  G01R1/07378 ,  H01F38/20 ,  H01F41/00 ,  H05K3/241 ,  H05K3/32 ,  Y10T29/4902 ,  Y10T29/49124

Abstract: A manufacturing method of a probing device is provided. The manufacturing method includes following steps. First, a plurality of space transformers is disposed on a reinforcing plate and the space transformer includes a plurality of first pads. Then, the space transformer is fixed on the reinforcing plate. Thereafter, photoresist films having a plurality of openings are formed on the space transformer. The first pads are disposed in the openings. After that, a metal layer is formed and covered on the first pad. Later, the photoresist film is removed and the metal layer planarized to form a second pad. Afterwards, the reinforcing plate is electrically connected with a PCB. Thereafter, a probe head having a plurality of probing area is provided and each probing area is corresponding to one of the space transformer. The probes in the probing area are electrically connected with the internal circuitry of the space transformer.

Abstract translation: 提供了一种探测装置的制造方法。 制造方法包括以下步骤。 首先，多个空间变压器设置在加强板上，空间变压器包括多个第一焊盘。 然后，空间变压器固定在加强板上。 此后，在空间变压器上形成具有多个开口的光致抗蚀剂膜。 第一垫设置在开口中。 之后，形成金属层并将其覆盖在第一焊盘上。 之后，除去光致抗蚀剂膜，并将金属层平坦化，形成第二焊盘。 之后，加强板与PCB电连接。 此后，设置具有多个探测区域的探头，并且每个探测区域对应于空间变换器之一。 探测区域中的探头与空间变压器的内部电路电连接。

公开(公告)号：US09823272B2

公开(公告)日：2017-11-21

申请号：US14162766

申请日：2014-01-24

Applicant: MPI Corporation

Inventor： Ming-Chi Chen ,  Tien-Chia Li ,  Dai-Jin Yeh ,  Tsung-Yi Chen ,  Chien-Kuei Wang

IPC: G01R31/02 ,  G01R1/073 ,  G01R1/067

CPC classification number: G01R1/0735 ,  G01R1/06733 ,  G01R1/07314

Abstract: A wafer testing probe card includes a printed circuit board, a flexible circuit board, an elastic piece, and a probe unit. The flexible circuit board is electrically connected to the printed circuit board. The elastic piece is disposed between the printed circuit board and the flexible circuit board. The probe unit includes a probe head and a plurality of probes. The probe head is fixed on the printed circuit board and has a plurality of through holes. The probes respectively pass through the through holes and move up and down relative to the probe head.

公开(公告)号：US09651578B2

公开(公告)日：2017-05-16

申请号：US14515537

申请日：2014-10-16

Applicant: MPI Corporation

Inventor： Chien-Chou Wu ,  Ming-Chi Chen ,  Tsung-Yi Chen ,  Chung-Che Li

IPC: G01R3/00 ,  G01R31/28 ,  B23K103/00

CPC classification number: G01R3/00 ,  B23K2103/42 ,  G01R31/2853 ,  G01R31/2887 ,  G01R31/2889 ,  Y10T29/49004 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/49222

Abstract: An assembly method of direct-docking probing device is provided. First, a space transforming plate made by back-end-of-line semiconductor manufacturing process is provided, so the thickness of the space transforming plate is predetermined by the client of probe card manufacturer. Then a reinforcing plate in which a plurality of circuits disposed is provided, which has larger mechanical strength than the space transforming plate. After that the reinforcing plate and the space transforming plate are joined and electrically connected by a plurality of solders so as to form a space transformer. Then, a conductive elastic member and a probe interface board are provided. Thereafter, the space transformer and the conductive elastic member are mounted on the probe interface board. After that, at least one vertical probe assembly having a plurality of vertical probes is mounted on the space transforming plate, and the vertical probes is electrically connected with the space transforming plate.

公开(公告)号：US09341648B2

公开(公告)日：2016-05-17

申请号：US13972930

申请日：2013-08-22

Applicant: MPI Corporation

Inventor： Chung-Tse Lee ,  Chien-Chou Wu ,  Tsung-Yi Chen ,  Ming-Chi Chen

IPC: G01R31/00 ,  G01R1/04 ,  G01R3/00 ,  G01R1/073

CPC classification number: G01R1/0491 ,  G01R1/07378 ,  G01R3/00 ,  Y10T29/49126

Abstract: The probe card includes a substrate, at least two IC boards, and a plurality of probe pads. The IC boards are located on the substrate, and a predetermined distance is formed between the IC boards. Each of the IC boards has a plurality of lead connection points. The probe pads are plated on the IC boards, and are respectively connected to the lead connection points to cover the lead connection points. A probe area is surrounded by the probe pads on each of the IC boards. The probe pads are used to abut against plural probes.

Abstract translation: 探针卡包括基板，至少两个IC板和多个探针垫。 IC板位于基板上，并且在IC板之间形成预定距离。 每个IC板具有多个引线连接点。 探针焊盘电镀在IC板上，并分别连接到引线连接点以覆盖引线连接点。 探针区域被每个IC板上的探针焊盘包围。 探针垫用于抵靠多个探针。