Invention Grant
- Patent Title: Method for reducing particle generation at bevel portion of substrate
- Patent Title (中): 降低基板斜面部分颗粒产生的方法
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Application No.: US14281477Application Date: 2014-05-19
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Publication No.: US09343343B2Publication Date: 2016-05-17
- Inventor: Yukihiro Mori
- Applicant: ASM IP Holding B.V.
- Applicant Address: NL Almere
- Assignee: ASM IP Holding B.V.
- Current Assignee: ASM IP Holding B.V.
- Current Assignee Address: NL Almere
- Agency: Snell & Wilmer LLP
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L21/677 ; H01L21/67 ; C23C16/50 ; H01J37/32 ; B25J11/00 ; C23C16/04 ; C23C16/458
Abstract:
A method for transporting a substrate using an end effector which mechanically clamps a periphery of the substrate includes: before transporting the substrate, depositing a compressive film only on, at, or in a bevel portion of the substrate; and transporting the substrate whose bevel portion is covered by the compressive film as the outermost film, using an end effector while mechanically clamping the periphery of the substrate.
Public/Granted literature
- US20150332949A1 Method For Reducing Particle Generation At Bevel Portion Of Substrate Public/Granted day:2015-11-19
Information query
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