Invention Grant
US09343531B2 Field effect transistor and method for fabricating field effect transistor
有权
场效应晶体管和制造场效应晶体管的方法
- Patent Title: Field effect transistor and method for fabricating field effect transistor
- Patent Title (中): 场效应晶体管和制造场效应晶体管的方法
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Application No.: US14455947Application Date: 2014-08-11
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Publication No.: US09343531B2Publication Date: 2016-05-17
- Inventor: Yi Chuen Eng
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Science-Based Industrial Park, Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Science-Based Industrial Park, Hsin-Chu
- Agent Winston Hsu; Scott Margo
- Priority: CN201410329243 20140711
- Main IPC: H01L27/148
- IPC: H01L27/148 ; H01L29/10 ; H01L29/78 ; H01L29/66

Abstract:
A field effect transistor includes a substrate, an isolation layer, a gate, a channel, drain and a source. The substrate has an active region having a rectangular area and at least one protrusion protruded from the rectangular area. The isolation layer is formed on the substrate and encircling the active region. The gate crosses the active region and is formed above a middle portion of the active region. The channel is formed in the active region directly under the gate, extends to the at least one protrusion, and divides the active region into a first section and a second section. The drain formed in the first section and the source formed in the second section.
Public/Granted literature
- US20160013272A1 FIELD EFFECT TRANSISTOR AND METHOD FOR FABRICATING FIELD EFFECT TRANSISTOR Public/Granted day:2016-01-14
Information query
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