Invention Grant
US09343535B2 Semiconductor packages having a guide wall and related systems and methods
有权
具有引导壁和相关系统和方法的半导体封装
- Patent Title: Semiconductor packages having a guide wall and related systems and methods
- Patent Title (中): 具有引导壁和相关系统和方法的半导体封装
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Application No.: US14019638Application Date: 2013-09-06
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Publication No.: US09343535B2Publication Date: 2016-05-17
- Inventor: Jung-Do Lee , Tae-Woo Kang , Dong-Han Kim , Yang-Hoon Ahn , Jang-Woo Lee , Dae-Young Choi
- Applicant: Jung-Do Lee , Tae-Woo Kang , Dong-Han Kim , Jang-Woo Lee
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel & Sibley, PA
- Priority: KR10-2012-0106600 20120925
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L29/34 ; H01L29/10 ; H01L23/367 ; H01L23/00 ; H01L23/42 ; H01L23/433 ; H01L21/56 ; H01L25/10 ; H01L23/498 ; H01L23/31
Abstract:
A semiconductor package includes a first package board, a first semiconductor chip arranged on the first package board, a heat transfer layer arranged on the first semiconductor chip, a heat spreader arranged on the heat transfer layer, and a housing having a molding part arranged on the first package board and directly surrounding side surfaces of the first semiconductor chip and a guide wall arranged on the molding part, with the guide wall spaced apart from the heat spreader and surrounding side surfaces of the heat spreader.
Public/Granted literature
- US20140084442A1 Semiconductor Packages Having a Guide Wall and Related Systems and Methods Public/Granted day:2014-03-27
Information query
IPC分类:
