发明授权
- 专利标题: Image pickup apparatus and camera module
- 专利标题(中): 摄像设备和相机模块
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申请号: US13566401申请日: 2012-08-03
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公开(公告)号: US09343597B2公开(公告)日: 2016-05-17
- 发明人: Masami Suzuki , Yoshihito Higashitsutsumi
- 申请人: Masami Suzuki , Yoshihito Higashitsutsumi
- 申请人地址: JP Tokyo
- 专利权人: SONY CORPORATION
- 当前专利权人: SONY CORPORATION
- 当前专利权人地址: JP Tokyo
- 代理机构: Hazuki International, LLC
- 优先权: JP2011-176125 20110811
- 主分类号: H04N5/225
- IPC分类号: H04N5/225 ; H01L31/0232 ; H04N5/369 ; H01L27/146
摘要:
An image pickup apparatus includes an optical device, a transparent conductive film, an electrode pad, and a penetrating electrode. In the optical device, an optical element area for receiving light is formed on a first surface side of a substrate, and an external connection terminal is formed on a side of a second surface opposite to the first surface of the substrate.The transparent conductive film is formed to face the first surface of the substrate. The electrode pad is formed on the first surface of the substrate and configured to perform connection with a fixed potential.The penetrating electrode is connected to the electrode pad and formed to penetrate the substrate between the first surface and second surface. The transparent conductive film is connected to the electrode pad, and the penetrating electrode is connected to the external connection terminal on the side of the second surface of the substrate.
公开/授权文献
- US20130194464A1 IMAGE PICKUP APPARATUS AND CAMERA MODULE 公开/授权日:2013-08-01
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