Invention Grant
- Patent Title: Light emitting diode module for surface mount technology and method of manufacturing the same
- Patent Title (中): 用于表面贴装技术的发光二极管模块及其制造方法
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Application No.: US14588878Application Date: 2015-01-02
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Publication No.: US09343644B2Publication Date: 2016-05-17
- Inventor: Jong Hyeon Chae , Jong Min Jang , Won Young Roh , Dae Woong Suh , Min Woo Kang , Joon Sub Lee , Hyun A Kim
- Applicant: Seoul Viosys Co., Ltd.
- Applicant Address: KR Ansan-si
- Assignee: Seoul Viosys Co., Ltd.
- Current Assignee: Seoul Viosys Co., Ltd.
- Current Assignee Address: KR Ansan-si
- Agency: Perkins Coie LLP
- Priority: KR1020120071576 20120702
- Main IPC: H01L33/62
- IPC: H01L33/62 ; H01L33/20 ; H01L33/38 ; H01L33/40 ; H01L33/50 ; H01L33/44 ; H01L33/32

Abstract:
Provided is a light emitting diode (LED) in which a side surface of a reflective metal layer has a predetermined angle, and occurrence of cracks in a conductive barrier layer formed on the reflective metal layer can be prevented. Also, an LED module using LEDs is disclosed. A reflection pattern electrically connected to a second semiconductor layer is partially exposed by patterning a first insulating layer. Accordingly, a first pad is formed through the partially opened first pad region. Also, a conductive reflection layer electrically connected to a first semiconductor layer forms a second pad region formed by patterning a second insulating layer. A second pad is formed on the second pad region.
Public/Granted literature
- US20150108528A1 LIGHT EMITTING DIODE MODULE FOR SURFACE MOUNT TECHNOLOGY AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2015-04-23
Information query
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