Invention Grant
US09349670B2 Semiconductor die assemblies with heat sink and associated systems and methods
有权
具有散热器和相关系统和方法的半导体模具组件
- Patent Title: Semiconductor die assemblies with heat sink and associated systems and methods
- Patent Title (中): 具有散热器和相关系统和方法的半导体模具组件
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Application No.: US14451192Application Date: 2014-08-04
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Publication No.: US09349670B2Publication Date: 2016-05-24
- Inventor: Wei Zhou , Zhaohui Ma , Aibin Yu
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Perkins Coie LLP
- Main IPC: H01L23/02
- IPC: H01L23/02 ; H01L23/12 ; H01L23/373 ; H01L25/065 ; H01L23/367 ; H01L25/00 ; H01L21/48
Abstract:
Semiconductor die assemblies with heat sinks are disclosed herein. In one embodiment, a semiconductor die assembly includes a stack of semiconductor dies and a mold material surrounding at least a portion of the stack of semiconductor dies. A heat sink is disposed on the stack of semiconductor dies and adjacent the mold material. The heat sink includes an exposed surface and a plurality of heat transfer features along the exposed surface that are configured to increase an exposed surface area compared to a planar surface.
Public/Granted literature
- US20160035648A1 SEMICONDUCTOR DIE ASSEMBLIES WITH HEAT SINK AND ASSOCIATED SYSTEMS AND METHODS Public/Granted day:2016-02-04
Information query
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