Invention Grant
- Patent Title: Multi level programmable memory structure
- Patent Title (中): 多级可编程存储器结构
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Application No.: US14313614Application Date: 2014-06-24
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Publication No.: US09349878B2Publication Date: 2016-05-24
- Inventor: Cheng-Hsien Cheng , Wen-Jer Tsai , Shih-Guei Yan , Chih-Chieh Cheng , Jyun-Siang Huang
- Applicant: MACRONIX International Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: MACRONIX International Co., Ltd.
- Current Assignee: MACRONIX International Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: J.C. Patents
- Main IPC: H01L29/792
- IPC: H01L29/792 ; H01L29/788 ; H01L27/115

Abstract:
A memory structure includes a memory cell, and the memory cell includes following elements. A first gate is disposed on a substrate. A stacked structure includes a first dielectric structure, a channel layer, a second dielectric structure and a second gate disposed on the first gate, a first charge storage structure disposed in the first dielectric structure and a second charge storage structure disposed in the second dielectric structure. The first charge storage structure is a singular charge storage unit and the second charge storage structure comprises two charge storage units which are physically separated. A channel output line physically connected to the channel layer. A first dielectric layer is disposed on the first gate at two sides of the stacked structure. A first source or drain and a second source or drain are disposed on the first dielectric layer and located at two sides of the channel layer.
Public/Granted literature
- US20140306282A1 MULTI LEVEL PROGRAMMABLE MEMORY STRUCTURE Public/Granted day:2014-10-16
Information query
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