Invention Grant
- Patent Title: Film stack including adhesive layer
- Patent Title (中): 薄膜叠层包括粘合剂层
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Application No.: US13873580Application Date: 2013-04-30
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Publication No.: US09352532B2Publication Date: 2016-05-31
- Inventor: James Elmer Abbott, Jr. , Peter Mardilovich , Randy Hoffman
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, LP
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Agency: HP Inc. Patent Department
- Main IPC: H01L41/09
- IPC: H01L41/09 ; H01L41/047 ; B32B7/12 ; H01L41/08
Abstract:
An example provides an apparatus including a substrate, a metal layer, and an adhesive layer adhered between the substrate and the metal layer, the adhesive layer comprising zinc-gallium oxide, zinc-indium oxide, zinc-gallium-tin oxide, or zinc-indium-tin oxide.
Public/Granted literature
- US20140319972A1 FILM STACK INCLUDING ADHESIVE LAYER Public/Granted day:2014-10-30
Information query
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