Invention Grant
US09353223B2 Polyamic acid, polyimide, polyamic acid solution, and use of polyimide 有权
聚酰胺酸,聚酰亚胺,聚酰胺酸溶液,以及聚酰亚胺的用途

Polyamic acid, polyimide, polyamic acid solution, and use of polyimide
Abstract:
The object of the present invention is to obtain the polyimide and the polyamic acid excellent in heat resistance, low thermal expansion property, and transparency and achieve low birefringence and to provide a product or a member, demanded to have high heat resistance and transparency, by using the polyimide or the polyamic acid. In particular, the object is to provide a product and a member in which the polyimide or the polyamic acid of the present invention is formed on a surface of an inorganic substance such as glass, metal, a metal oxide, or a single crystal silicon. The objects are attained by introducing a rigid structure and an alicyclic structure into a skeleton and using a monomer having a fluorene skeleton together.
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