Invention Grant
US09353223B2 Polyamic acid, polyimide, polyamic acid solution, and use of polyimide
有权
聚酰胺酸,聚酰亚胺,聚酰胺酸溶液,以及聚酰亚胺的用途
- Patent Title: Polyamic acid, polyimide, polyamic acid solution, and use of polyimide
- Patent Title (中): 聚酰胺酸,聚酰亚胺,聚酰胺酸溶液,以及聚酰亚胺的用途
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Application No.: US14409126Application Date: 2013-06-25
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Publication No.: US09353223B2Publication Date: 2016-05-31
- Inventor: Mari Fujii , Shinji Ozawa , Tomohiro Abo
- Applicant: KANEKA CORPORATION
- Applicant Address: JP Osaka
- Assignee: KANEKA CORPORATION
- Current Assignee: KANEKA CORPORATION
- Current Assignee Address: JP Osaka
- Agency: Kagan Binder, PLLC
- Priority: JP2012-148588 20120702
- International Application: PCT/JP2013/067370 WO 20130625
- International Announcement: WO2014/007112 WO 20140109
- Main IPC: C08G73/10
- IPC: C08G73/10 ; B29C41/24 ; C08G73/16 ; C08G69/00 ; C09D179/08

Abstract:
The object of the present invention is to obtain the polyimide and the polyamic acid excellent in heat resistance, low thermal expansion property, and transparency and achieve low birefringence and to provide a product or a member, demanded to have high heat resistance and transparency, by using the polyimide or the polyamic acid. In particular, the object is to provide a product and a member in which the polyimide or the polyamic acid of the present invention is formed on a surface of an inorganic substance such as glass, metal, a metal oxide, or a single crystal silicon. The objects are attained by introducing a rigid structure and an alicyclic structure into a skeleton and using a monomer having a fluorene skeleton together.
Public/Granted literature
- US20150183931A1 POLYAMIC ACID, POLYIMIDE, POLYAMIC ACID SOLUTION, AND USE OF POLYIMIDE Public/Granted day:2015-07-02
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