Invention Grant
- Patent Title: Heating/cooling pedestal for semiconductor-processing apparatus
- Patent Title (中): 半导体加工设备的加热/冷却基座
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Application No.: US13646403Application Date: 2012-10-05
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Publication No.: US09353441B2Publication Date: 2016-05-31
- Inventor: Hsiao Pei Chung , Hirofumi Arai , Dai Ishikawa
- Applicant: ASM IP Holding B.V.
- Applicant Address: NL Almere
- Assignee: ASM IP Holding B.V.
- Current Assignee: ASM IP Holding B.V.
- Current Assignee Address: NL Almere
- Agency: Snell & Wilmer LLP
- Main IPC: C23C16/50
- IPC: C23C16/50 ; C23C16/00 ; C23F1/00 ; H01L21/306 ; C23C16/458 ; H01L21/67 ; H01J37/32 ; F27D5/00
Abstract:
A pedestal for supporting a substrate includes: a heating plate for heating the substrate; an upper cooling plate for cooling the substrate, installed on the heating plate and provided with an upper fluid path for passing a cooling fluid therethrough; and an lower cooling plate for cooling the substrate, installed under the heating plate and including a lower fluid path for passing a cooling fluid therethrough.
Public/Granted literature
- US20140096716A1 Heating/Cooling Pedestal for Semiconductor-Processing Apparatus Public/Granted day:2014-04-10
Information query
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