Invention Grant
- Patent Title: Methods and structure for carrier-less thin wafer handling
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Application No.: US14722672Application Date: 2015-05-27
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Publication No.: US09355905B2Publication Date: 2016-05-31
- Inventor: Cyprian Emeka Uzoh , Pezhman Monadgemi , Michael Newman , Charles G. Woychik , Terrence Caskey
- Applicant: Invensas Corporation
- Applicant Address: US CA San Jose
- Assignee: Invensas Corporation
- Current Assignee: Invensas Corporation
- Current Assignee Address: US CA San Jose
- Agency: Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- Main IPC: H01L21/768
- IPC: H01L21/768 ; H01L21/78 ; H01L21/56 ; H01L23/48 ; H01L21/3105 ; H01L21/683 ; H01L23/00

Abstract:
Methods of forming a microelectronic assembly and the resulting structures and devices are disclosed herein. In one embodiment, a method of forming a microelectronic assembly includes removing material exposed at portions of a surface of a substrate to form a processed substrate having a plurality of thinned portions separated by integral supporting portions of the processed substrate having a thickness greater than a thickness of the thinned portions, at least some of the thinned portions including a plurality of electrically conductive interconnects extending in a direction of the thicknesses of the thinned portions and exposed at the surface; and removing the supporting portions of the substrate to sever the substrate into a plurality of individual thinned portions, at least some individual thinned portions including the interconnects.
Public/Granted literature
- US20150255345A1 METHODS AND STRUCTURE FOR CARRIER-LESS THIN WAFER HANDLING Public/Granted day:2015-09-10
Information query
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