发明授权
- 专利标题： Integrated circuit packaging system with interposer structure and method of manufacture thereof
- 专利标题（中）： 具有内插器结构的集成电路封装系统及其制造方法
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申请号： US14318061申请日： 2014-06-27
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公开(公告)号： US09355983B1公开(公告)日： 2016-05-31
- 发明人: Zigmund Ramirez Camacho , Emmanuel Espiritu , Bartholomew Liao Chung Foh , Dao Nguyen Phu Cuong , Jeffrey David Punzalan
- 申请人： Zigmund Ramirez Camacho , Emmanuel Espiritu , Bartholomew Liao Chung Foh , Dao Nguyen Phu Cuong , Jeffrey David Punzalan
- 申请人地址： SG Singapore
- 专利权人： STATS ChipPAC Ltd.
- 当前专利权人： STATS ChipPAC Ltd.
- 当前专利权人地址： SG Singapore
- 代理机构： Ishimaru & Associates LLP
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L23/00
摘要：
A system and a method of manufacture thereof of integrated circuit packaging system, including: a pillar; a conductive buildup attached to the pillar; and a molded body encapsulating the conductive buildup, the pillar extending out of the molded body.
公开/授权文献
- US3134176A Adjustable curve for drafting 公开/授权日：1964-05-26
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