Invention Grant
- Patent Title: Integrated circuit and method for manufacturing the same
- Patent Title (中): 集成电路及其制造方法
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Application No.: US13775789Application Date: 2013-02-25
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Publication No.: US09356604B2Publication Date: 2016-05-31
- Inventor: Berndt Gammel , Thomas Nirschl , Gerd Dirscherl , Philip Schlazer , Stefan Rueping
- Applicant: INFINEON TECHNOLOGIES AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Schiff Hardin LLP
- Main IPC: H03K19/20
- IPC: H03K19/20 ; G11C13/00 ; H01L27/24
Abstract:
An integrated circuit has one or more logic gates and a control circuit. The control circuit has one or more control elements coupled to the logic gates. The control circuit controls the states of the one or more logic gates.
Public/Granted literature
- US20130176053A1 INTEGRATED CIRCUIT AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2013-07-11
Information query
IPC分类:
