发明授权
- 专利标题: Method for reducing intermetallic compounds in matrix bit bondline
- 专利标题(中): 降低基质位线中金属间化合物的方法
-
申请号: US14162501申请日: 2014-01-23
-
公开(公告)号: US09359824B2公开(公告)日: 2016-06-07
- 发明人: Gary M. Thigpen , Federico Bellin , Marvin Windsor Amundsen , Olivier Ther , Alfazazi Dourfaye , Bruno Cuillier De Maindreville , Williams Gomez
- 申请人: Varel Europe S.A.S.
- 申请人地址: FR Pau
- 专利权人: VAREL EUROPE S.A.S.
- 当前专利权人: VAREL EUROPE S.A.S.
- 当前专利权人地址: FR Pau
- 主分类号: E21B10/54
- IPC分类号: E21B10/54 ; E21B10/42 ; B22D19/06 ; B22F7/08 ; C22C29/08 ; E21B10/00 ; B22F5/00
摘要:
An apparatus and method for manufacturing a downhole tool that reduces failures occurring along a bondline between a cemented matrix coupled around a blank. The cemented matrix material is formed from a tungsten carbide powder, a shoulder powder, and a binder material, wherein at least one of the tungsten carbide powder or the shoulder powder is absent of any free tungsten. The blank, which optionally may be coated, is substantially cylindrically shaped and defines a channel extending from a top portion and through a bottom portion of the blank. The absence of free tungsten from at least one of the tungsten carbide powder or the shoulder powder reduces the reaction with iron from the blank, thereby allowing the control and reduction of intermetallic compounds thickness within the bondline.
公开/授权文献
信息查询