Invention Grant
- Patent Title: Substrate treating apparatus and blocker plate assembly
- Patent Title (中): 基板处理装置和阻挡板组件
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Application No.: US14463166Application Date: 2014-08-19
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Publication No.: US09362091B2Publication Date: 2016-06-07
- Inventor: Soyoung Lee , Suho Lee , Chang-Yun Lee , Ik Soo Kim , Juhyun Lee , Jongwon Hong
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-Si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-Si, Gyeonggi-Do
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2013-0157325 20131217
- Main IPC: H01L21/306
- IPC: H01L21/306 ; C23F1/00 ; H01J37/32 ; C23C16/455 ; C23C16/50

Abstract:
A substrate treating apparatus includes a chamber that encloses an internal space; a susceptor in a lower part of the internal space; a shower head in an upper part of the internal space and spaced above the susceptor and that includes a plurality of distribution holes; and a blocker plate assembly that comprises a body having a plurality of intake holes that divides a space between a top wall of the chamber and the shower head into an upper intake space and a lower distribution space, a ring-shaped partition rib on an upper surface of the body, and a ring-shaped distribution unit on a lower surface of the body.
Public/Granted literature
- US20150167705A1 SUBSTRATE TREATING APPARATUS AND BLOCKER PLATE ASSEMBLY Public/Granted day:2015-06-18
Information query
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