A method for making a set of electronic devices is proposed. The method comprises the steps of providing a support comprising a base plate of electrically conductive material, fixing a set of chips of semiconductor material onto respective portions of the base plate, each chip having a first main surface with at least one first conduction terminal and a second main surface opposite the first main surface with at least one second conduction terminal electrically connected to the base plate, fixing an insulating tape of electrically insulating material comprising a plurality of through-holes to the main surface of each chip, the insulating tape protruding from the chips over a further portion of the base plate being not covered by the chips, and forming at least one first electrical contact to each first terminal of the chips through a first set of the through-holes exposing at least in part said first terminal, and at least one second electrical contact to the base plate through a second set of the through-holes exposing at least in part the further portion of the base plate.