The invention relates to a printed circuit board arrangement, more particularly a multilayer printed circuit board. The printed circuit board arrangement comprises at least two printed circuit boards which are arranged parallel to one another and connected to one another. According to the invention, in the case of the printed circuit board arrangement of the type mentioned initially, at least one surface region of one printed circuit board is connected to another printed circuit board of the printed circuit board arrangement by means of an element embodied in an elastic and/or damping fashion in such a way that an oscillatory system, more particularly a spring-mass system, an oscillatory bending strip or a flexurally oscillatory board is formed by means of the surface region of the printed circuit board and the element.