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    Method for packaging a sensor chip, and a component produced using such a method
    1.
    发明申请
    Method for packaging a sensor chip, and a component produced using such a method 审中-公开
    用于封装传感器芯片的方法，以及使用这种方法制造的部件

    公开(公告)号：US20120161260A1

    公开(公告)日：2012-06-28

    申请号：US13334398

    申请日：2011-12-22

    Applicant: Uwe HANSEN ,  Lutz Rauscher

    Inventor： Uwe HANSEN ,  Lutz Rauscher

    IPC: H01L29/84 ,  H01L29/66 ,  H01L21/56

    CPC classification number: B81B7/0061 ,  H01L2224/48095 ,  H01L2224/48465 ,  H04R19/005 ,  H04R19/04 ,  H04R31/00

    Abstract: Measures are introduced to make possible a low-cost packaging of sensor chips having a media access. For this purpose, the sensor chip is first mounted on a substrate and is contacted. The sensor chip is then at least partially embedded in a molding compound. Finally, at least one portion of the media access is produced by the subsequent structuring of the molding compound.

    Abstract translation: 引入了措施，使得具有媒体访问的传感器芯片的低成本封装成为可能。 为此，传感器芯片首先安装在基板上并被接触。 然后将传感器芯片至少部分地嵌入模塑料中。 最后，介质通道的至少一部分通过随后的模塑料的结构而产生。

    Control and regulation device for a vehicle travel drive
    4.
    发明授权
    Control and regulation device for a vehicle travel drive 失效
    车辆行驶驱动器的控制和调节装置

    公开(公告)号：US5542251A

    公开(公告)日：1996-08-06

    申请号：US343516

    申请日：1994-12-05

    Applicant: Karl-Heinz Leibing ,  Kai-Uwe Hansen ,  Reinhard Vonnoe

    Inventor： Karl-Heinz Leibing ,  Kai-Uwe Hansen ,  Reinhard Vonnoe

    IPC: B60K7/00 ,  B60K17/10 ,  B62D11/18 ,  F16H61/42 ,  F16H61/425 ,  F16H61/435 ,  F16H61/46 ,  F16H61/47 ,  F16D31/02

    CPC classification number: F16H61/435 ,  B60K17/10 ,  B62D11/183 ,  F16H61/425 ,  F16H61/46 ,  F16H61/47 ,  B60K7/0015 ,  B60Y2200/25

    Abstract: A control and regulation device for a vehicle travel drive, which comprises two hydrostatic transmissions (3, 4) of adjustable transmission ratios, each comprising a hydraulic pump (12, 13) and a hydraulic motor (14, 15), which are in driving connection with two vehicle track arrangements (18, 19) and have each an adjustment device (30, 24; 31, 25) controllable with control signals (v.sub.l, v.sub.r) for adjusting the transmission ratio, with a control section comprising a desired-value setting apparatus (5) and a signal processing means (42, 43), whereby the desired-value setting means sets transmission ratio desired-values of each hydrostatic transmission, employing respective adjustable control levers (36, 37), and outputs desired-value signals (s.sub.l, s.sub.r), and the signal processing apparatus processes desired-value signals to control signals (s.sub.l, s.sub.r) and outputs the latter. For the avoidance of undesired travel speed alterations the signal processing (42, 43) is formed for the formation of a min./max. window from desired-value signals (s.sub.l, s.sub.r) for the determination of control signals (v.sub.l, v.sub.r) if the mean value of v.sub.l and v.sub.r lies within the min./max. window, and if not, corrects the control signals to be outputted.

    Abstract translation: PCT No.PCT / EP93 / 01821 Sec。 371日期1994年12月5日第 102（e）日期1994年12月5日PCT提交1993年7月12日PCT公布。 公开号WO94 / 02346 日期1994年2月3日一种用于车辆行驶驱动器的控制和调节装置，其包括两个可调节传动比的静液压传动装置（3,4），每个包括液压泵（12,13）和液压马达（14,15） ，它们与两个车辆轨道装置（18,19）驱动连接，并且每个调节装置（30,24; 31,25）可用用于调节传动比的控制信号（v1，vr）控制，控制部分 包括期望值设定装置（5）和信号处理装置（42,43），由此所述期望值设定装置使用各自的可调节控制杆（36,37）设定每个静液压传动装置的传动比期望值， 并输出期望值信号（sl，sr），并且信号处理装置处理期望值信号以控制信号（sl，sr）并输出。 为了避免不期望的移动速度改变，形成信号处理（42,43）以形成最小/最大值。 如果v1和vr的平均值在最小/最大值内，则用于确定控制信号（f1，vr）的期望值信号（sl，sr）的窗口。 窗口，如果不是，则更正要输出的控制信号。

    Method and apparatus for low-loss storage of thermal energy and for low-loss withdrawal of the stored thermal energy
    5.
    发明授权
    Method and apparatus for low-loss storage of thermal energy and for low-loss withdrawal of the stored thermal energy 失效
    用于低损耗储存热能的方法和装置以及储存的热能的低损耗提取

    公开(公告)号：US4219074A

    公开(公告)日：1980-08-26

    申请号：US867431

    申请日：1978-01-06

    Applicant: Uwe Hansen

    Inventor： Uwe Hansen

    IPC: F28D20/00 ,  F28D21/00

    CPC classification number: F28D20/0052 ,  Y02E60/142

    Abstract: Method of low-loss thermal energy storage in and withdrawal from a heat accumulator connected with an energy source and a heat consumer in a circulatory system through which a heat-carrying flow medium circulates which includes passing the flow medium through the energy source so as to withdraw thermal energy from the energy source and effect absorption of the thermal energy by the flow medium, guiding the flow medium in respective layers within the heat accumulator in a direction from the center of the heat accumulator toward the periphery thereof so as to store the thermal energy in a heat storage mass disposed in the heat accumulator; and guiding the flow medium in the layers thereof through the heat accumulator in a direction from the periphery of the heat accumulator to the center thereof, and passing the flow medium from the heat accumulator through the consumer so as to withdraw thermal energy therefrom and transfer it to the consumer; and apparatus therefor.

    Abstract translation: 在循环系统中与能量源和热消耗器连接的蓄热器中的低损耗热能储存和从其中退出的方法，通过所述循环系统，热载体流动介质循环通过所述循环系统，所述循环系统包括使所述流动介质通过所述能量源，以便 从能量源中抽出热能，并通过流动介质吸收热能，在储热器内的各层中沿着蓄热器中心向其周边的方向引导流动介质，以便储存热量 设置在蓄热器中的储热体的能量; 并且通过蓄热器从储热器的周边到其中心的方向引导其中的流动介质，并且使来自蓄热器的流动介质通过消耗器从其中取出热能并将其传递 给消费者 及其装置。

    PRINTED CIRCUIT BOARD ARRANGEMENT COMPRISING AN OSCILLATORY SYSTEM
    7.
    发明申请
    PRINTED CIRCUIT BOARD ARRANGEMENT COMPRISING AN OSCILLATORY SYSTEM 有权
    印刷电路板布置包括振荡系统

    公开(公告)号：US20140055974A1

    公开(公告)日：2014-02-27

    申请号：US14114528

    申请日：2012-04-20

    Applicant: Uwe Hansen

    Inventor： Uwe Hansen

    IPC: H05K1/14

    CPC classification number: H05K1/148 ,  G01L19/06 ,  G01P15/0802 ,  G01P15/09 ,  G01P15/125 ,  G01P2015/0882 ,  H05K1/0271 ,  H05K1/14 ,  H05K1/141 ,  H05K1/142 ,  H05K1/144 ,  H05K1/145 ,  H05K3/0064 ,  H05K3/4611 ,  H05K5/0056 ,  H05K2201/0133 ,  H05K2201/041 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/10083 ,  H05K2201/10151

    Abstract: The invention relates to a printed circuit board arrangement, more particularly a multilayer printed circuit board. The printed circuit board arrangement comprises at least two printed circuit boards which are arranged parallel to one another and connected to one another. According to the invention, in the case of the printed circuit board arrangement of the type mentioned initially, at least one surface region of one printed circuit board is connected to another printed circuit board of the printed circuit board arrangement by means of an element embodied in an elastic and/or damping fashion in such a way that an oscillatory system, more particularly a spring-mass system, an oscillatory bending strip or a flexurally oscillatory board is formed by means of the surface region of the printed circuit board and the element.

    Abstract translation: 本发明涉及一种印刷电路板装置，更具体地说涉及一种多层印刷电路板。 印刷电路板布置包括彼此平行布置并彼此连接的至少两个印刷电路板。 根据本发明，在最初提及的类型的印刷电路板布置的情况下，一个印刷电路板的至少一个表面区域通过实施在印刷电路板装置中的元件连接到印刷电路板装置的另一个印刷电路板 弹性和/或阻尼方式，使得通过印刷电路板和元件的表面区域形成振荡系统，特别是弹簧质量系统，振荡弯曲带或弯曲振荡板。

    SENSOR HAVING DAMPING
    8.
    发明申请
    SENSOR HAVING DAMPING 有权
    传感器有阻尼

    公开(公告)号：US20130044442A1

    公开(公告)日：2013-02-21

    申请号：US13521573

    申请日：2011-01-14

    Applicant: Tristan Jobert ,  Uwe Hansen

    Inventor： Tristan Jobert ,  Uwe Hansen

    IPC: H05K1/18 ,  H05K3/30

    CPC classification number: H01L23/5387 ,  H01L23/3121 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/1461 ,  H05K1/18 ,  Y10T29/4913 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: A sensor device, having a flexible printed circuit board that has a fastening section for a chip structure, a chip structure situated on the fastening section of the flexible printed-circuit board, and a damper element for damping the chip structure from mechanical influences. The fastening section of the flexible printed circuit board, the chip structure and the damper element are situated one on top of the other.

    Abstract translation: 一种具有柔性印刷电路板的传感器装置，其具有用于芯片结构的紧固部分，位于柔性印刷电路板的紧固部分上的芯片结构以及用于阻止芯片结构受到机械影响的阻尼元件。 柔性印刷电路板的紧固部分，芯片结构和阻尼元件一个位于另一个之上。

    Sensor system
    9.
    发明申请
    Sensor system 有权
    传感器系统

    公开(公告)号：US20110203369A1

    公开(公告)日：2011-08-25

    申请号：US12931011

    申请日：2011-01-21

    Applicant: Holger Hoefer ,  Uwe Hansen ,  Michael Knauss

    Inventor： Holger Hoefer ,  Uwe Hansen ,  Michael Knauss

    IPC: G01D11/24

    CPC classification number: G01P1/023 ,  B81B7/0048 ,  G01D3/028 ,  G01D11/245 ,  G06K19/07747 ,  H01L2224/48137

    Abstract: A sensor system includes a supporting element and a sensor element attached to the supporting element and having a main plane of extension. The supporting element has (i) at least one contact element for electrical contacting of the sensor system and (ii) at least one relief structure for stress decoupling, the at least one relief structure being situated in a plane parallel to the main plane of extension essentially between the at least one contact element and the sensor element.

    Abstract translation: 传感器系统包括支撑元件和附接到支撑元件并具有主平面延伸的传感器元件。 所述支撑元件具有（i）至少一个用于所述传感器系统的电接触的接触元件和（ii）用于应力解耦的至少一个浮雕结构，所述至少一个浮雕结构位于平行于所述主延伸平面的平面中 基本上在所述至少一个接触元件和所述传感器元件之间。

    Sensor having damping
    10.
    发明授权
    Sensor having damping 有权
    传感器有阻尼

    公开(公告)号：US09263395B2

    公开(公告)日：2016-02-16

    申请号：US13521573

    申请日：2011-01-14

    Applicant: Tristan Jobert ,  Uwe Hansen

    Inventor： Tristan Jobert ,  Uwe Hansen

    IPC: H05K1/18 ,  H01L23/538 ,  H01L23/31

    CPC classification number: H01L23/5387 ,  H01L23/3121 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/1461 ,  H05K1/18 ,  Y10T29/4913 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: A sensor device, having a flexible printed circuit board that has a fastening section for a chip structure, a chip structure situated on the fastening section of the flexible printed-circuit board, and a damper element for damping the chip structure from mechanical influences. The fastening section of the flexible printed circuit board, the chip structure and the damper element are situated one on top of the other.

    Abstract translation: 一种具有柔性印刷电路板的传感器装置，其具有用于芯片结构的紧固部分，位于柔性印刷电路板的紧固部分上的芯片结构以及用于阻止芯片结构受到机械影响的阻尼元件。 柔性印刷电路板的紧固部分，芯片结构和阻尼元件一个位于另一个之上。

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