发明授权
- 专利标题： Systems and methods of controlling semiconductor wafer fabrication processes
- 专利标题（中）： 控制半导体晶圆制造工艺的系统和方法
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申请号： US13419952申请日： 2012-03-14
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公开(公告)号： US09368379B2公开(公告)日： 2016-06-14
- 发明人: Shih-Hung Chen , Ying Xiao , Chin-Hsiang Lin
- 申请人： Shih-Hung Chen , Ying Xiao , Chin-Hsiang Lin
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Duane Morris LLP
- 主分类号： G06F15/00
- IPC分类号： G06F15/00 ; G01B11/26 ; H01L21/67 ; H01L21/68 ; H01L21/687
摘要：
A system and method of controlling a semiconductor wafer fabrication process. The method includes positioning a semiconductor wafer on a wafer support assembly in a wafer processing module. A signal is transmitted from a signal emitter positioned at a predetermined transmission angle relative to an axis normal to the wafer support assembly to check leveling of the wafer in the module, so that the signal is reflected from the wafer. The embodiment includes monitoring for the reflected signal at a predetermined reflectance angle relative to the axis normal to the wafer support assembly at a signal receiver. A warning indication is generated if the reflected signal is not received at the signal receiver.
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