Invention Grant
- Patent Title: Self aligned contact formation
- Patent Title (中): 自对准接触形成
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Application No.: US14583864Application Date: 2014-12-29
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Publication No.: US09368446B2Publication Date: 2016-06-14
- Inventor: Neng-Kuo Chen , Shao-Ming Yu , Gin-chen Huang , Chia-Jung Hsu , Sey-Ping Sun , Clement Hsingjen Wann
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Eschweiler & Associates, LLC
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L23/528 ; H01L29/78 ; H01L21/02 ; H01L29/66 ; H01L21/768 ; H01L23/532 ; H01L29/49

Abstract:
The present disclosure relates to methods of forming a self-aligned contact and related apparatus. In some embodiments, the method forms a plurality of gate lines interspersed between a plurality of dielectric lines, wherein the gate lines and the dielectric lines extend in a first direction over an active area. One or more of the plurality of gate lines are into a plurality of gate line sections aligned in the first direction. One or more of the plurality of dielectric lines are cut into a plurality of dielectric lines sections aligned in the first direction. A dummy isolation material is deposited between adjacent dielectric sections in the first direction and between adjacent gate line sections in the first direction. One or more self-aligned metal contacts are then formed by replacing a part of one or more of the plurality of dielectric lines over the active area with a contact metal.
Public/Granted literature
- US20150108651A1 SELF ALIGNED CONTACT FORMATION Public/Granted day:2015-04-23
Information query
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