Invention Grant
- Patent Title: Substrate recycling method and recycled substrate
- Patent Title (中): 基材回收方法和回收底材
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Application No.: US14085876Application Date: 2013-11-21
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Publication No.: US09373496B2Publication Date: 2016-06-21
- Inventor: Joo Won Choi , Chang Yeon Kim , Jeong Hoon Heo , Young Wug Kim , Su Yeon Hong , Sang Wan Ryu
- Applicant: SEOUL VIOSYS CO., LTD.
- Applicant Address: KR Ansan-si
- Assignee: Seoul Viosys Co., Ltd.
- Current Assignee: Seoul Viosys Co., Ltd.
- Current Assignee Address: KR Ansan-si
- Agency: H.C. Park & Associates, PLC
- Priority: KR10-2012-0132379 20121121; KR10-2012-0145041 20121213
- Main IPC: H01L21/302
- IPC: H01L21/302 ; H01L21/02 ; H01L29/20 ; H01L33/00

Abstract:
Exemplary embodiments of the present invention provide a substrate recycling method and a recycled substrate. The method includes separating a substrate having a first surface from an epitaxial layer, performing a first etching of the first surface using electrochemical etching, and performing, after the first etching, a second etching of the first surface using chemical etching, dry etching, or performing, after the first etching, chemical mechanical polishing of the first surface.
Public/Granted literature
- US20140138702A1 SUBSTRATE RECYCLING METHOD AND RECYCLED SUBSTRATE Public/Granted day:2014-05-22
Information query
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