Invention Grant
- Patent Title: Stress-inducing structures, methods, and materials
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Application No.: US14565243Application Date: 2014-12-09
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Publication No.: US09373717B2Publication Date: 2016-06-21
- Inventor: Alois Gutmann , Roland Hampp , Scott Jansen
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/762
- IPC: H01L21/762 ; H01L29/78 ; H01L29/06 ; H01L29/12
Abstract:
Stress-inducing structures, methods, and materials are disclosed. In one embodiment, an isolation region includes an insulating material in a lower portion of a trench formed in a workpiece and a stress-inducing material disposed in a top portion of the trench over the insulating material.
Public/Granted literature
- US20150137253A1 Stress-inducing Structures, Methods, and Materials Public/Granted day:2015-05-21
Information query
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