Invention Grant
- Patent Title: Power amplifying module
- Patent Title (中): 功率放大模块
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Application No.: US14561414Application Date: 2014-12-05
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Publication No.: US09374040B2Publication Date: 2016-06-21
- Inventor: Toshiki Matsui
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Pearne & Gordon LLP
- Priority: JP2013-257376 20131212
- Main IPC: H03F1/22
- IPC: H03F1/22 ; H03F1/02 ; H03F3/19 ; H03F1/32 ; H03F1/56 ; H03F3/21 ; H03F3/24

Abstract:
The linearity of a power amplifying module employing an envelope tracking scheme is improved. The power amplifying module includes a first bipolar transistor having a base to which a first radio frequency signal is input and an emitter grounded, and a second bipolar transistor having a base to which a first constant voltage is applied, a collector to which a first power supply voltage is applied, the first power supply voltage adapted to vary in accordance with an amplitude of the first radio frequency signal, and an emitter connected to a collector of the first bipolar transistor. The second bipolar transistor is configured to output a first amplified signal, obtained by amplifying the first radio frequency signal, from the collector of the second bipolar transistor.
Public/Granted literature
- US20150171796A1 POWER AMPLIFYING MODULE Public/Granted day:2015-06-18
Information query
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