Invention Grant
- Patent Title: Method for manufacturing a micromechanical system
- Patent Title (中): 微机械系统的制造方法
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Application No.: US14315979Application Date: 2014-06-26
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Publication No.: US09376314B2Publication Date: 2016-06-28
- Inventor: Thoralf Kautzsch , Heiko Froehlich , Mirko Vogt , Maik Stegemann , Boris Binder
- Applicant: Infineon Technologies Dresden GmbH
- Applicant Address: DE Dresden
- Assignee: Infineon Technologies Dresden GmbH
- Current Assignee: Infineon Technologies Dresden GmbH
- Current Assignee Address: DE Dresden
- Agency: Eschweiler & Associates, LLC
- Main IPC: H01L27/20
- IPC: H01L27/20 ; H01L29/84 ; B81C1/00 ; B81B7/00
Abstract:
A method for manufacturing a micromechanical system includes forming in a Front-End-of-Line (FEOL) process transistors in a transistor region; after the FEOL-process, forming a sacrificial layer; structuring the sacrificial layer to form a structured sacrificial layer; forming a functional layer at least partially covering the structured sacrificial layer; and removing the sacrificial layer to create a cavity.
Public/Granted literature
- US20150375998A1 MICROMECHANICAL SYSTEM AND METHOD FOR MANUFACTURING A MICROMECHANICAL SYSTEM Public/Granted day:2015-12-31
Information query
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