Invention Grant
- Patent Title: Multilayer electronic component and method of manufacturing the same
- Patent Title (中): 多层电子元件及其制造方法
-
Application No.: US14201379Application Date: 2014-03-07
-
Publication No.: US09378884B2Publication Date: 2016-06-28
- Inventor: Ic Seob Kim , Ho Yoon Kim , Myeong Gi Kim
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-Si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-Si, Gyeonggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2013-0150823 20131205
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F27/28 ; H01F41/00 ; H01F27/24 ; H01F27/00 ; H01F17/00 ; H01F17/04 ; H01F41/04
Abstract:
There are provided a multilayer electronic component and a method of manufacturing the same. More particularly, there are provided a multilayer electronic component capable of maintaining high inductance at a high frequency due to excellent magnetic properties and having excellent DC bias properties and a dense fine structure to thereby improve strength, and a method of manufacturing the same.
Public/Granted literature
- US20150162124A1 MULTILAYER ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2015-06-11
Information query
